Research & Development

Co-packaged optics is the latest innovation in data centers where optical modules on silicon chips can assist in scaling megawatt AI infrastructure. (Source: © Rachakrit - stock.adobe.com)

This article explains PMBus in data center power supplies. (Source: © Gibster - stock.adobe.com)

Photonic integrated circuits are next-level chips that will dominate data centers in the upcoming years. (Source: © pier - stock.adobe.com)

AI data centers are moving toward 800 VDC distribution and megawatt-scale racks, creating a new power architecture in which SiC and GaN technologies serve different stages from the grid connection to the GPU. (Source: © Ahmed - stock.adobe.com)

Conceptual illustration of polar wurtzite niobium aluminum nitride (NbAlN), a transition-metal-containing nitride semiconductor that preserves the crystal structure and polarity of GaN. (Source: Associate Professor Atsushi Kobayashi from Tokyo University of Science, Japan)

Average models allow power designers to simulate DC‑DC converters and three‑phase PFC circuits quickly, analyse small‑signal behaviour and evaluate loop stability without modelling every switching event. (Source: © AI - stock.adobe.com)

Grid-forming inverters are also known as grid-forming resources and grid-forming IBR. This article explains grid-forming inverters in detail. (Bild: © only_kim - stock.adobe.com)

Rising demand for high-end materials shifts production toward higher-margin products, reducing output of standard loss materials. (Source: NCAB)

Hitachi Energy is supporting SF6‑free grid modernization with new EconiQ circuit breaker orders for high‑voltage applications in North America and Europe. (Source: Hitachi Energy)

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