Navitas Semiconductor has announced an ultra-high-voltage (UHV) SiC power module family for advanced energy and grid infrastructure. It has been developed to enhance efficiency and power density in solid-state transformers, grid-scale battery energy storage systems, solar inverters, and EV megawatt charging infrastructure.

Power Integrations has expanded its industry-leading CAPZero family of X-capacitor discharge ICs with the introduction of the CAPZero-4 device for industrial and consumer applications. Power Integrations pioneered the X-capacitor discharge function, which disengages the energy-consuming discharge resistor in an AC-DC power supply until the device is unplugged and the resistor is needed to safely bleed power from the X-capacitor.

Yokogawa Test & Measurement Corporation announces the release of its new AC/DC split core current sensors, the CT500SA and CT200SA. These products have been developed to meet the need for more accurate and simplified current measurement in high current applications such as electric vehicles (xEVs) and renewable energy where energy efficiency is increasingly important.

The EIRE600 delivers its full 600W output with either forced-air or conduction cooling. Where fan-less operation is preferred, it can provide up to 450W using natural convection at 115 VAC. For applications with short-duration higher power requirements, up to 750W is available for three seconds.

Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe. As part of the project, Infineon will invest around €1.1 billion in its existing cleanroom facilities at the Villach site by 2034. Leveraging both the existing and upgraded infrastructure will enable highly efficient and cost-effective expansion of manufacturing capacity. Production is scheduled to start by the end of 2027.

Vertical Semiconductor, a power semiconductor company, has announced it has signed a letter of intent with the U.S. Department of Commerce’s CHIPS Research and Development Office (CRDO) to receive up to $73 million in federal incentives under the CHIPS and Science Act. The proposed incentives are expected to accelerate research and development of next-generation vertical gallium nitride (GaN) power transistors, unlock domestic production of this technology, and strengthen U.S. leadership in power infrastructure for artificial intelligence (AI) and high-performance computing.

United Microelectronics Corporation and AP Memory have announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC’s deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory’s silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.

Siemens has unveiled new AI solutions at its Electronics Factory in Erlangen, Germany, marking a new milestone in its partnership with NVIDIA to advance AI-driven, autonomous manufacturing. The applications that are currently unique in the manufacturing industry use AI and digital twins to accelerate production ramp-up and enable more adaptive production planning.

This paper presents a lifetime prediction methodology for power semiconductor devices, utilizing an Arrhenius-based power cycling lifetime model as well as a temperature-dependent correction of lifetime curves.

This paper presents a neural network-based method for the detection of high impedance faults (HIF), utilizing a Levenberg-Marquardt-trained artificial neural network as well as a realistic two-diode HIF model in MATLAB Simulink.

This paper presents a retrofittable, IoT-based onboard diagnostics device for electric vehicles, utilizing a decision tree algorithm based on FMEA principles as well as real-time multi-source data from motor, controller, and battery.

Oxide layers, residues and process variation can undermine bonding, sintering and long-term reliability. Learn how controlled plasma processes create reproducible surface conditions for modern power electronics packaging.

In this article, the author shows how to simulate and stabilize a Vienna rectifier without sensing the high-voltage rail. This so-called predictive control is popular in single-phase power factor correction (PFC) circuits and lends itself well to controlling the power switches of a three-phase PFC. Learn how LTspice simulations associated with SIMPLIS can help closing the loop for a stable operation of the converter.

Silicon-rich lithium-ion batteries promise high energy densities for applications in electric mobility, aerospace, and stationary energy storage. However, their industrial application has so far been limited primarily by their limited cycle life. In the project “StrOboBatt,” researchers at the Fraunhofer Institute for Solar Energy Systems ISE succeeded in operating in-house-manufactured 25-Ah pouch cells with silicon-rich anodes for more than 1,000 full cycles.

Virtual power plants (VPPs) can replace traditional power plants by offering similar functionalities in the cloud. VPPs help renewable-heavy grid operations bypass coordination constraints. On a wider note, virtual power plants support electrification and decarbonization initiatives.

Accelerating electrification powered by renewables must be a priority for the decade to 2035. A genuine energy transition means progressively displacing fossil-fuel systems, not simply adding new power capacity to an unchanged energy mix. Electrification with renewables, combined with more efficient technologies and sustainable fuels, can drive this shift by scaling clean power, unlocking energy efficiency gains, and meeting rising energy demand.

Hioki E.E. Corporation has developed a measurement standard that resolves a long-standing accuracy gap in high-frequency power calibration, delivering calibration accuracy approximately ten times greater than was previously achievable — including under methods used by national metrology institutes. By exploiting the physical principle that power losses ultimately manifest as heat, Hioki’s new calorimeter-based system detects heat generation as small as 0.01% of input apparent power, hardly dependent of operating frequency.

Replacing established silicon technology requires more than design alone. It requires proven reliability under real operating conditions. To ensure a new power supply can perform in demanding environments, particularly in medical and industrial systems, hardware must undergo extensive endurance testing before deployment.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.