The EIRE600 delivers its full 600W output with either forced-air or conduction cooling. Where fan-less operation is preferred, it can provide up to 450W using natural convection at 115 VAC. For applications with short-duration higher power requirements, up to 750W is available for three seconds.

Littelfuse, Inc. has announced the launch of its TP7.0SMD-XC Series automotive-grade transient voltage suppression (TVS) diodes, led by the TP7.0SMD24CA-XC. The new series uses advanced foldback technology to achieve an extremely low, flat-clamping voltage while handling up to 7000 W of peak pulse power in a compact surface-mount package.

Microchip Technology has announced the POL-05-20S-T, a radiation-tolerant, Point-of-Load (POL) converter, designed to address the demanding power requirements of space processing applications. The new device uses Gallium Nitride (GaN) power devices to deliver up to 20A of output current with high efficiency and power density.

By harnessing the properties of gallium nitride, EPFL engineers have built a tiny transistor that can handle very high voltage with minimal energy loss, a key requirement for AI data centers, electric vehicles, and solar power systems.

Siemens has unveiled new AI solutions at its Electronics Factory in Erlangen, Germany, marking a new milestone in its partnership with NVIDIA to advance AI-driven, autonomous manufacturing. The applications that are currently unique in the manufacturing industry use AI and digital twins to accelerate production ramp-up and enable more adaptive production planning.

Infineon Technologies AG and Wolfspeed, Inc. have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology. SiC semiconductors have become a key enabling technology for the electrification and energy efficiency applications that drive global decarbonization, from electric vehicles and renewable energy systems to AI datacenter power infrastructure.

AI is pushing data center electricity demand and rack power density to new levels. Dr. Michael Jörger explains why efficient conversion depends on more than the semiconductor, and how die attach, substrates and top-side interconnects help determine the performance and reliability of future AI power infrastructure.

Wolfspeed, Inc. has announced it has received a conditional loan commitment letter from the U.S. Department of War (“DoW”), through its Office of Strategic Capital (“OSC”), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

This paper presents a neural network-based method for the detection of high impedance faults (HIF), utilizing a Levenberg-Marquardt-trained artificial neural network as well as a realistic two-diode HIF model in MATLAB Simulink.

This paper presents a retrofittable, IoT-based onboard diagnostics device for electric vehicles, utilizing a decision tree algorithm based on FMEA principles as well as real-time multi-source data from motor, controller, and battery.

Oxide layers, residues and process variation can undermine bonding, sintering and long-term reliability. Learn how controlled plasma processes create reproducible surface conditions for modern power electronics packaging.

This paper presents the first industrialized 100 A / 800 V Smart Semiconductor Hybrid Circuit Breaker (SCHCB), utilizing a hybrid switching concept combining a high-speed mechanical arcing switch, a bidirectional power semiconductor switch, a robust voltage clamping circuit, and a mechanical isolation contact system.

Silicon-rich lithium-ion batteries promise high energy densities for applications in electric mobility, aerospace, and stationary energy storage. However, their industrial application has so far been limited primarily by their limited cycle life. In the project “StrOboBatt,” researchers at the Fraunhofer Institute for Solar Energy Systems ISE succeeded in operating in-house-manufactured 25-Ah pouch cells with silicon-rich anodes for more than 1,000 full cycles.

Virtual power plants (VPPs) can replace traditional power plants by offering similar functionalities in the cloud. VPPs help renewable-heavy grid operations bypass coordination constraints. On a wider note, virtual power plants support electrification and decarbonization initiatives.

Accelerating electrification powered by renewables must be a priority for the decade to 2035. A genuine energy transition means progressively displacing fossil-fuel systems, not simply adding new power capacity to an unchanged energy mix. Electrification with renewables, combined with more efficient technologies and sustainable fuels, can drive this shift by scaling clean power, unlocking energy efficiency gains, and meeting rising energy demand.

onsemi has announced that Sungrow, a global leader in renewable energy technology, has adopted onsemi’s latest EliteSiC silicon carbide (SiC) hybrid power module technology for the Sungrow PowerTitan 3.0 energy storage platform. The integration enables improved efficiency and enhanced system performance for utility-scale battery energy storage systems (BESS)

Hioki E.E. Corporation has developed a measurement standard that resolves a long-standing accuracy gap in high-frequency power calibration, delivering calibration accuracy approximately ten times greater than was previously achievable — including under methods used by national metrology institutes. By exploiting the physical principle that power losses ultimately manifest as heat, Hioki’s new calorimeter-based system detects heat generation as small as 0.01% of input apparent power, hardly dependent of operating frequency.

Replacing established silicon technology requires more than design alone. It requires proven reliability under real operating conditions. To ensure a new power supply can perform in demanding environments, particularly in medical and industrial systems, hardware must undergo extensive endurance testing before deployment.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.