EPC Space, a manufacturer of radiation-hardened, high-performance, and enhanced-reliability GaN discrete transistors, integrated circuits, and modular devices, has announced three new eGaN power transistors in plastic surface-mount packages, designed to deliver high-performance power conversion for next-generation space computing systems.

Littelfuse, Inc. has announced the TPSMD-FL Series FlatSuppressX TVS Diodes, a new family of automotive-grade transient voltage suppression devices designed to simplify ISO 7637-2 Pulse 5b load-dump protection for 12 V vehicle electronics.

Bourns has announced the release of the CFG-A Series Wide-Terminal Metal Foil Current Sense Resistors, available in 0508 and 0612 footprints. Rated up to 2 W and covering a resistance range of 1–30 mΩ, the CFG-A Series is AEC-Q200-compliant and designed for automotive power electronics, motor drives, and other high-reliability applications where accurate, thermally stable current measurement is required.

TDK Corporation has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series of existing B41687/B41787 (25 V to 63 V). This complements the product spectrum, addressing the increasing demand for compact and high-ripple-current DC-link capacitor banks with battery voltages ranging from 48-V battery systems to 120 V. These are frequently used in applications such as small xEVs and micromobility platforms, as well as industrial systems like forklifts, electric boats, and humanoid robots.

From August 26 to 28, the PCIM Asia Shenzhen 2026 brought experts from industry, science, and research together at the Shenzhen World Exhibition & Convention Center for an event that reaffirmed its role as one of Asia's leading platforms for power electronics.

GlobalWafers Co., Ltd. announced that it has joined the SEMI Taiwan Materials Alliance, with GlobalWafers Chairperson and CEO Doris Hsu serving as one of the Alliance’s chairs. Leveraging its long-standing expertise in semiconductor materials, technological capabilities, and global supply experience, GlobalWafers will work closely with industry partners to advance critical materials technologies and strengthen semiconductor supply chain resilience.

Infineon Technologies AG has announced the acquisition of C2i Semiconductors, a Bangalore-based technology company specializing in software-defined multiphase controllers and smart power stages for AI data center applications. C2i Semiconductors’ technology complements Infineon’s leading portfolio of power semiconductors and power systems, enabling intelligent and scalable power delivery architectures from grid to core for AI servers and high-performance computing platforms.

Hitachi Energy has announced a $300 million USD investment in China to strengthen its global manufacturing footprint and address rapidly growing demand for transformers. The investment will bolster the company’s power transformer and component manufacturing capacity in Hefei, East China’s Anhui Province, strengthening the resilience of the global transformer value chain to help ease supply chain constraints.

This paper presents a low-complexity digital active gate driver, utilizing only two gate resistances with a single resistance changeover per switching event as well as a novel clock-frequency tuning method for sub-nanosecond timing resolution.

This paper presents the first industrialized 100 A / 800 V Smart Semiconductor Hybrid Circuit Breaker (SCHCB), utilizing a hybrid switching concept combining a high-speed mechanical arcing switch, a bidirectional power semiconductor switch, a robust voltage clamping circuit, and a mechanical isolation contact system.

This paper presents a novel and fully bidirectional test concept for active short-circuit (ASC) characterization, utilizing two high-current-rated IGBTs operated in the active region as well as flexible gate-voltage-based current control.

This paper presents a novel matched-lifetime sequencing methodology for power cycling tests, utilizing an AC power cycling test bench as well as a controlled mixed-stress protocol on 1.2 kV/150 A IGBT modules.

The world is transitioning from the conventional grid to the renewable-dominated one, backed by solar, wind, and batteries. The problem with the renewable-backed grid is the lack of stability. Instead of synchronous generators, it uses inverter-based resources (IBR) to facilitate stable operation. However, when a disturbance hits, the inverter system has very little to hold it together. Times have changed as newer types, such as grid-forming inverters (GFMs), start supporting the grid.

The rapid growth in AI and related infrastructure continues to place significant pressure on the PCB supply chain. Glass yarn shortages remain a major challenge and, from our recent discussions with factory partners, concerns are growing that copper foil shortages could further impact the supply of copper clad laminates (CCL) to PCB factories.

Hitachi Energy, a global leader in electrification, today announced the launch of new additions in its EconiQ high-voltage portfolio at CIGRE 2026 in Paris, reinforcing the company’s leadership in SF6-free technologies for the grid of the future. As nations accelerate efforts to cut carbon emissions, replacing sulfur hexafluoride (SF6) in power grids is a crucial step toward more sustainable infrastructure.

Silicon carbide on-board charger (SiC OBC) is a power converter, factory-fitted by the automaker into battery electric vehicles (BEVs) and plug-in hybrid EVs (PHEVs). For years, automakers chose silicon to build on-board chargers, but now they have shifted to choosing a compound made from silicon and carbon: silicon carbide, a wide-bandgap power semiconductor, to manufacture 98% more efficient on-board chargers.With high efficiency, high costs come as a trade-off!

Hioki E.E. Corporation has developed a measurement standard that resolves a long-standing accuracy gap in high-frequency power calibration, delivering calibration accuracy approximately ten times greater than was previously achievable — including under methods used by national metrology institutes. By exploiting the physical principle that power losses ultimately manifest as heat, Hioki’s new calorimeter-based system detects heat generation as small as 0.01% of input apparent power, hardly dependent of operating frequency.

Replacing established silicon technology requires more than design alone. It requires proven reliability under real operating conditions. To ensure a new power supply can perform in demanding environments, particularly in medical and industrial systems, hardware must undergo extensive endurance testing before deployment.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.