Infineon Technologies AG expands its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward.

Expanding its award-winning line of Technomelt low pressure molding materials, Henkel has announced the addition of Technomelt PA 6370, a highly flowable, ultra-low melt viscosity formulation engineered for the most intricate and challenging electronic systems and components. Capable of thoroughly filling gaps as small as 0.5mm, the new polyamide-based hot melt meets rigorous industry requirements to ensure rugged moisture, heat, corrosion, and environmental resistance, elevating operational reliability.

With a new range of Power ICs and SMD transformers, RECOM enables customers to create their own discrete DC/DC isolated power supplies. The range includes transformers compatible with flyback, push-pull and full bridge drivers in the power range from 1W to 30W. These standard sub-miniature SMD transformers cover the most common input/output voltage combinations and isolation withstand voltages up to 5000VAC/min. They will withstand a peak reflow temperature of up to 250°C for up to 10s and can withstand two times reflow process.

Moore4Power (More than Moore for Disruptive Innovations in Power Electronics) is one of Europe’s most ambitious semiconductor R&D projects. Led by Infineon Technologies AG, the Chips Joint Undertaking initiative brings together large corporations, small and medium‑sized enterprises and research institutes from 15 European countries to develop the next generation of smart, efficient and sustainable power electronics. With a total project volume of €91 million and a planned three‑year runtime, Moore4Power aims to deliver breakthrough innovations that strengthen Europe’s technological sovereignty and sustainability in power electronics.

When the international power electronics industry gathers in Nuremberg for the PCIM Expo & Conference from June 9 to 11, 2026, the event will be about much more than just technologies and trends – it will be about the future of the industry. Starting on June 8, the new PCIM Executive Circle will bring together selected decision-makers in an exclusive setting to openly discuss strategic issues facing the industry and generate new ideas.

Tata Electronics and ASML have announced the signing of a Memorandum of Understanding (MoU) to advance the semiconductor manufacturing ecosystem in India. Through this partnership, ASML will enable the establishment and successful ramp of Tata Electronics’ upcoming 300 mm (12 inch) semiconductor fab in Dholera, Gujarat. This collaboration is an important step in the context of the intensifying strategic collaboration between India and The Netherlands in the field of critical technologies, such as semiconductor technology.

Vishay Intertechnology has announced that the company will showcase its latest passive component technologies, semiconductors, and reference designs at PCIM 2026, taking place June 9–11 in Nuremberg, Germany (Hall 9, Booth 208). Under the event’s focus on advancing electrification, decarbonization, and energy efficiency, Vishay will highlight solutions that enable higher power density, improved thermal performance, and increased system reliability across a wide range of applications.

The Semiconductor Industry Association (SIA) today announced global semiconductor sales were $298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025. Global sales were $99.5 billion during the month of March 2026, an increase of 79.2% compared to the March 2025 total of $55.5 billion and 11.5% more than sales in February 2026.

As AI servers require higher power density and efficient PCB space utilization, power device packaging and switching characteristics become increasingly important. This whitepaper examines practical approaches using 600V SJ MOSFETs and TOLL packaging.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

Modern power systems don’t have a single source or load. The need for efficiency drives a system to run multiple power conversion stages in parallel. A multiport converter (MPC) enters the picture, replacing modular power conversion cells. Simply put, multiport converters can replace cascaded converters by integrating more than two distinct energy sources and loads into a single aggregated controllable hub. In renewable-backed grids, multiport converters can result in efficient energy management, grid stability, and cost savings.

Flexible AC transmission systems (FACTS) devices handle peak power management when load demand spikes or transients occur due to weather. The problem with “peak hours" is that they don’t stay continuous, but exist for a small duration at specific, predictable times. FACTS devices come to the rescue where laying an additional transmission line or adding a substation to handle peak load is costly, impractical, and troublesome. The devices were commercialised around the 1980s, but failed to reach large-scale adoption.

With electrified systems moving to higher battery voltages and more distributed electrical architectures, the role of the DC-DC converter is changing dramatically. Historically, the HV-LV converters have been mainly designed for the supply of auxiliary 12 V loads and are now evolving towards dynamic energy management nodes able to manage regenerative energy flows, stabilize low-voltage networks, and support highly transient electrical loads.

Analog Devices, Inc and Empower Semiconductor have announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion. As AI compute scales, power density – not just total watts – has become the limiting factor. Delivering high-density, high-efficiency power at the point of compute, while responding to fast-changing demands, is now one of the most critical challenges in system design.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Keysight Technologies, launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family. The R&S FPL1044 is an industry first, delivering high-frequency performance up to 44 GHz at a price point previously unattainable in the market. The universal RTSA option empowers FPL users with powerful real-time analysis capabilities.

Siemens has expanded the TIA Selection Tool Cloud with the new “Electrical Designer” feature for electrical planning. This smart software is the first and only in the IEC market that includes basic electrical knowledge and standards expertise. Electrical Designer simplifies main circuit design by automatically selecting components, verifying short-circuits, sizing cables, and creating all necessary documentation.