As the automotive industry accelerates toward electrification and data centers scale rapidly to support AI workloads, the demand for robust and reliable circuit protection has never been greater. YAGEO Group intrroduced the KH-AT Series, a new family of AEC-Q200 qualified, automotive-grade Metal Oxide Varistors (MOVs) engineered to deliver long-term reliability in the harshest operating environments.

TAIYO YUDEN CO., has commercialized the new HVX (-K) and HTX (-K) series of conductive polymer hybrid aluminum electrolytic capacitors that comply with the AEC-Q200 (Note 1) Stress Test Qualification for Passive Components.

Toshiba Electronic Devices & Storage Corporation has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centers and communications base stations.

Magnachip Semiconductor Corporation has announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI server power applications.

GlobalWafers Co., Ltd.has announced it will deepen its long‑term strategic partnership with Micron Technology, Inc., and that both parties have agreed in principle to cooperate on a Long‑Term Agreement (LTA) and related collaboration frameworks. The collaboration aims to further enhance the resilience of advanced semiconductor raw silicon wafer supply, support the growing demand for advanced memory driven by AI, high-performance computing, and data center applications.

Keysight Technologies, Inc. and WIN Semiconductors Corp. have announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first pass tapeout success. The workflow connects on-chip multi-domain simulation, 3D layout with verifications, and off-chip MMIC evaluation board design into a single environment. It supports the growing number of companies developing GaN MMICs for 5G base stations, Wi-Fi access points, satellite payloads, and defense radar systems.

Siemens Energy has reached an agreement to acquire Camlin Group, a Northern Ireland-based specialist in grid monitoring, analytics and asset digitalization technologies. The acquisition will expand Siemens Energy’s digital grid portfolio at a time of accelerated global investment in electricity networks. Financial details were not disclosed. The transaction is subject to regulatory approvals and is expected to close before the end of 2026.

Infineon Technologies AG opened the Smart Power Fab in Dresden several months ahead of schedule. The new plant, with an investment volume of five billion euros, is the largest single investment in Infineon's history and one of the largest investment projects in Germany, creating 1,000 new, direct jobs.

As AI servers require higher power density and efficient PCB space utilization, power device packaging and switching characteristics become increasingly important. This whitepaper examines practical approaches using 600V SJ MOSFETs and TOLL packaging.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

Huawei unveiled LUTERRA, its next‑generation grid‑forming ESS platform at The Smarter E 2026, featuring a 1000 Vac architecture and plant‑level grid‑forming capabilities for utility‑scale PV+ESS. The company also showcased the Smarter E Award‑winning SUN2000‑506KTL 506 kW smart string inverter and introduced the LUTERRA S2 SiC residential system, extending grid‑forming technology from large plants to the home market.

The Fraunhofer Institute for Integrated Systems and Device Technology IISB and PVA TePla AG are pooling their expertise in a joint lab for the production of aluminum nitride (AlN) crystals. As a European first, this partnership enables industrially supported smallbatch production of monocrystalline AlN substrates with a diameter of two inches for research and development purposes. This significantly improves the availability of AlN substrates in Europe, which in turn accelerates the development of AlN-based devices and systems and their transition to industrial applications.

Allegro MicroSystems, Inc. (“Allegro”) has introduced the A81415, the industry's first ASIL-D-certified Power Management IC (PMIC) to integrate a wheel-speed sensor interface. The new device provides electromechanical braking (EMB) designers with a substantially simplified, single-chip power and sensing foundation for next-generation brake-by-wire systems.

Onsemi has announced it has entered into definitive agreements to divest two manufacturing facilities. These planned divestitures are part of onsemi’s ongoing initiative to improve companywide manufacturing cost structure to drive sustained gross margin expansion as part of its Fab Right strategy.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Keysight Technologies, launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.