Metal specialist voestalpine Precision Strip is replacing solid bronze strip with a laser-welded metal composite strip made of bronze and copper-coated iron. While maintaining the same processability and similar electrical conductivity, this enables material cost savings of up to 25%.

Toshiba International Corporation has announced the launch of the Toshiba 1100 TP Series Uninterruptible Power System (UPS), a three-phase 208V modular UPS platform designed to provide reliable backup power protection for critical IT, industrial, and commercial applications. Built for scalability, efficiency, and simplified serviceability, the 1100 TP Series helps organizations meet evolving power requirements with scalable backup power protection.

Littelfuse, Inc has announced AQ4315-01ETG and SP4315-01WTG, two new bidirectional TVS diode arrays (SPA diodes) that combine industry-leading low-clamping voltage with ultra-low capacitance to protect today’s fastest automotive and consumer data interfaces from electrostatic discharge (ESD) without compromising signal integrity.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its GaN portfolio into low-voltage applications with its first family of 100V enhancement mode (E-mode) GaN-based discrete power transistors. The low-voltage GaN FETs deliver ultra-fast switching speeds and enhanced thermal performance in efficiency-critical, high power density applications, including AI data centers, humanoid robotics, factory automation and industrial motor drives, power tools and solar microinverters.

Wolfspeed, Inc. has announced it has received a conditional loan commitment letter from the U.S. Department of War (“DoW”), through its Office of Strategic Capital (“OSC”), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

Metal specialist voestalpine Precision Strip is replacing solid bronze strip with a laser-welded metal composite strip made of bronze and copper-coated iron. While maintaining the same processability and similar electrical conductivity, this enables material cost savings of up to 25%.

SEMI has announced that SEMI Europe has joined the European Commission's newly established STEAM Executive Panel bringing the semiconductor industry’s perspective to discussions on skills, education, and workforce development.

Infineon Technologies AG has announced the completion of its acquisition of C2i Semiconductors, a Bengaluru-based technology company specializing in software-defined multiphase controllers and smart power stages for AI data center applications. C2i Semiconductors’ technology complements Infineon’s portfolio of power semiconductors and power systems, enabling intelligent and scalable power delivery architectures from grid to core for AI servers and high-performance computing platforms.

Oxide layers, residues and process variation can undermine bonding, sintering and long-term reliability. Learn how controlled plasma processes create reproducible surface conditions for modern power electronics packaging.

This paper presents a novel optimization methodology for shared DC-link (SDCL) architectures in paralleled inverters, utilizing phase-shifted carrier PWM as well as a fast MATLAB-based current reconstruction method.

This paper presents a novel and fully bidirectional test concept for active short-circuit (ASC) characterization, utilizing two high-current-rated IGBTs operated in the active region as well as flexible gate-voltage-based current control.

This paper presents a novel matched-lifetime sequencing methodology for power cycling tests, utilizing an AC power cycling test bench as well as a controlled mixed-stress protocol on 1.2 kV/150 A IGBT modules.

Metal specialist voestalpine Precision Strip is replacing solid bronze strip with a laser-welded metal composite strip made of bronze and copper-coated iron. While maintaining the same processability and similar electrical conductivity, this enables material cost savings of up to 25%.

Geopolitical tensions and material constraints are reshaping supply chains. Learn why diversified sourcing of both basic and advanced materials are critical for resilient and competitive power electronics.

Data center power gets all the hype. Medical equipment, even more safety-critical, is rarely discussed. The power supply unit (PSU) supports patient monitors, CT scanners, PET scanners, or infusion pumps that cannot tolerate an unstable voltage/power rail. In some situations, the equipment can also be connected to the patient's heart. That’s why medical PSUs must function properly.

As utility-scale battery storage scales toward the megawatt-frequency wall, traditional Silicon IGBTs are turning into major thermal bottlenecks. Resolving this density crisis demands a complete architecture overhaul.

Hioki E.E. Corporation has developed a measurement standard that resolves a long-standing accuracy gap in high-frequency power calibration, delivering calibration accuracy approximately ten times greater than was previously achievable — including under methods used by national metrology institutes. By exploiting the physical principle that power losses ultimately manifest as heat, Hioki’s new calorimeter-based system detects heat generation as small as 0.01% of input apparent power, hardly dependent of operating frequency.

Replacing established silicon technology requires more than design alone. It requires proven reliability under real operating conditions. To ensure a new power supply can perform in demanding environments, particularly in medical and industrial systems, hardware must undergo extensive endurance testing before deployment.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.