Products & Applications

New CoolGaN BDS devices integrate back‑to‑back switching in a single package, delivering low gate charge, ultra‑low leakage and improved efficiency for fast‑charging mobile power systems. (symbolic image) (Source: © Kitta Studio - stock.adobe.com)

With Technomelt PA 6370 Henkel has launched a new low pressure molding hot melt for challenging electronic device designs. (Source: Henkel AG & Co. KGaA)

RECOM unveils discrete isolated DC/DC building blocks — SMD transformers, RVP driver ICs and RVS rectifiers — enabling modular, reflow‑compatible power designs for flyback, push‑pull and full‑bridge topologies (Source: RECOM)

Infineon has launched Moore4Power, a €91 million EU “Chips JU” flagship project with 62 partners across 15 countries to accelerate sustainable, smart and integrated power‑electronics solutions in Europe. (Source: © Dzmitry - stock.adobe.com)

Wolfspeed introduces new 3.3 kV SiC power modules in two industry‑standard footprints to meet rising demand for efficient, high‑voltage power conversion in energy and industrial applications. (Source: Wolfspeed)

New 1200 V trench‑gate SiC MOSFET samples from Toshiba target high‑efficiency server power supplies and DC–DC stages. (Source: Toshiba)

BLOCK – space saving, customer specific EMI filters and line reactors. (Source:
BLOCK Transformatoren-Elektronik GmbH)

SB4000 GFCIs provide 6 mA personnel protection, digital filtering to reduce nuisance trips and UL‑compliant self‑test firmware for reliable protection in harsh settings. (Source: Littelfuse)

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