Products & Applications

Toshiba introduces new automotive MOSFETs designed to improve efficiency and reliability in vehicle power systems. (Source: Toshiba)

Littelfuse introduces ultra-miniature DIP switches designed for space-constrained electronic applications. (Source: Littelfuse)

Infineon's silicon carbide power semiconductors will enhance efficiency, power density and reliability of DG Matrix's solid-state transformer platform

(Source: Infineon)

Bourns introduces high-current shielded power inductors designed for compact, high-density electronic applications. (Source: BOURNS)

The new TOPSwitchGaN flyback IC family extends the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies. (Source: Power Integrations)

The new evaluation platform enables developers to explore the performance benefits of seventh-generation GaN technology in motor control systems. (Source: © danter - stock.adobe.com)

EPC’s Phase 18 report provides new insights into the reliability and robustness of eGaN power devices under real-world operating conditions. (Source: © danter - stock.adobe.com)

Microchip’s new BZpack SiC power modules are designed to deliver high efficiency and reliability in demanding power conversion applications. (Source: Microchip)

Renesas introduces a 650 V bidirectional GaN switch designed to improve efficiency and enable new architectures in power conversion systems for solar, energy storage, and AI data centers. (Source: Renesas)

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