Products & Applications

The new MX series by GES High Voltage: Handling up to 20 kV DC and supporting up to 9 poles. (Source: GES High Voltage)

ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support (Source: ROHM)

Integrated, thermally optimized line reactor for power electronics applications. (Source: Block)

The new high performance fuses from Mersen combine the best AC/DC electrical characteristics in a single compact housing (Source: Mersen)

Cambridge GaN Devices introduces a 650 V ICeGaN device for automotive traction inverters — enabling smaller, lighter, and more efficient inverters to help increase EV range. (Source: © Curie - stock.adobe.com)

Mitsubishi Electric begins shipping 5th‑generation SiC MOSFET bare‑die samples, delivering lower on‑resistance and improved efficiency for high‑density power converters in automotive and industrial applications. (symbolic image) (Source: © DigitalSpace - stock.adobe.com)

Looking ahead to continued growth in the AI server and data center markets, ROHM will further strengthen the development and supply of power devices using SiC, GaN, and silicon. (Source: © mevideo - stock.adobe.com)

New CoolGaN BDS devices integrate back‑to‑back switching in a single package, delivering low gate charge, ultra‑low leakage and improved efficiency for fast‑charging mobile power systems. (symbolic image) (Source: © Kitta Studio - stock.adobe.com)

With Technomelt PA 6370 Henkel has launched a new low pressure molding hot melt for challenging electronic device designs. (Source: Henkel AG & Co. KGaA)

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