Advanced Energy Industries, Inc. has announced a new 1100 W board‑mounted power factor correction (PFC) module, the industry’s first of its kind in a half‑brick form factor. Advanced Energy’s AIH03ZPFC is designed for applications in industrial, medical, defense and telecommunications systems where size, thermal performance and efficiency are critical.

As the automotive industry accelerates toward electrification and data centers scale rapidly to support AI workloads, the demand for robust and reliable circuit protection has never been greater. YAGEO Group intrroduced the KH-AT Series, a new family of AEC-Q200 qualified, automotive-grade Metal Oxide Varistors (MOVs) engineered to deliver long-term reliability in the harshest operating environments.

TAIYO YUDEN CO., has commercialized the new HVX (-K) and HTX (-K) series of conductive polymer hybrid aluminum electrolytic capacitors that comply with the AEC-Q200 (Note 1) Stress Test Qualification for Passive Components.

Toshiba Electronic Devices & Storage Corporation has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centers and communications base stations.

United Microelectronics Corporation has announced that its Board of Directors has approved a phased expansion plan, beginning with immediate cleanroom capacity increases in Singapore and the start of construction for a new fab building shell at its Tainan campus.

CATL and Solarpro Technology AD (Solarpro) have announced the signing of a strategic cooperation agreement for 2 GWh sodium-ion systems. This marks a significant milestone in advancing the adoption of next-generation storage technologies and the transition toward more resilient and sustainable energy systems in Eastern Europe.

Bosch announced a definitive agreement with the Trump Administration for up to $225 million in direct funding from the Department of Commerce’s CHIPS Program Office to support the up to $2 billion Bosch is investing to transform its Roseville, California site for the production of silicon carbide (SiC) semiconductors.

Infineon Technologies AG and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to collaborate on high-efficiency direct current (DC) power infrastructure solutions for AI data centers and next-generation power grids. Accordingly, the two companies will collaborate on key technologies to enhance energy efficiency, system performance and scalability in next-generation power infrastructure.

This paper presents a novel matched-lifetime sequencing methodology for power cycling tests, utilizing an AC power cycling test bench as well as a controlled mixed-stress protocol on 1.2 kV/150 A IGBT modules.

This paper presents a novel and fully bidirectional test concept for active short-circuit (ASC) characterization, utilizing two high-current-rated IGBTs operated in the active region as well as flexible gate-voltage-based current control.

This paper presents a novel optimization methodology for shared DC-link (SDCL) architectures in paralleled inverters, utilizing phase-shifted carrier PWM as well as a fast MATLAB-based current reconstruction method.

This paper presents the first industrialized 100 A / 800 V Smart Semiconductor Hybrid Circuit Breaker (SCHCB), utilizing a hybrid switching concept combining a high-speed mechanical arcing switch, a bidirectional power semiconductor switch, a robust voltage clamping circuit, and a mechanical isolation contact system.

As Europe enters the electricity era, demand for clean power is accelerating across industry, transportation, and digital infrastructure, making the expansion of grid capacity a critical enabler of energy security, economic growth, and societal progress. To help address this need, Hitachi Energy and Larsen & Toubro (L&T), have announced receiving the award of Nederwiek3 and LanWin5, the third and fourth projects under their previously announced multi-year Framework Agreement with TenneT.

Packaging materials account for roughly a third of a power module's cost, and in modern SiC modules, they increasingly set its lifetime too. A silver-sintered die attach survives around 22 times more power cycles than a soldered one in Infineon's published testing, a silicon nitride AMB substrate withstands 5,000 thermal shock cycles where standard alumina DBC fails at 55, and embedding the die in the substrate cuts commutation loop inductance from tens of nanohenries to roughly one.

Agrivoltaics refers to the practice of placing photovoltaic (PV) arrays above agricultural land, where solar panels generate electricity for the grid but also provide shade to the crops. During the sunny season, crops shaded by solar panels can grow with a reduced need for extra irrigation, which further lowers water loss in agriculture.

Silicon carbide went into 1.17 million EV traction inverters in Q1 2026, or 17.2% of everything shipped, according to TrendForce, and Yole Group forecasts an $11 billion power SiC device market by 2031. Power GaN generated $355 million in 2024 and is heading toward roughly $3 billion by 2030 at a 42% CAGR, per Yole, with more than half of that 2030 market still in consumer chargers and mobile.

Hioki E.E. Corporation has developed a measurement standard that resolves a long-standing accuracy gap in high-frequency power calibration, delivering calibration accuracy approximately ten times greater than was previously achievable — including under methods used by national metrology institutes. By exploiting the physical principle that power losses ultimately manifest as heat, Hioki’s new calorimeter-based system detects heat generation as small as 0.01% of input apparent power, hardly dependent of operating frequency.

Replacing established silicon technology requires more than design alone. It requires proven reliability under real operating conditions. To ensure a new power supply can perform in demanding environments, particularly in medical and industrial systems, hardware must undergo extensive endurance testing before deployment.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.