he demand for low-voltage clock drivers continues to grow with the rapid adoption of advanced FinFET process nodes used in high-performance FPGAs, SoCs, AI accelerators and next-generation CPUs. Printed circuit board designers face increasing challenges due to the limited availability of standard 1.2V LVCMOS clock buffers and level-translating buffers capable of converting higher-voltage clock signals to the lower-voltage levels required by these advanced devices.

Capacitors in data centers perform various functions, including multi-layer ceramic capacitors for LLC tank resonant conversion and EMI filtering, film capacitors in DC links, and aluminum electrolytic and polymer capacitors near the load. As capacitors sit next to the PSU, they function as a local energy reservoir to prevent failures. The article explains how capacitors are becoming more important than ever for data center power supplies.

KYOCERA AVX, a manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released two new series of compact, vibration-proof aluminum electrolytic capacitors engineered for harsh industrial environments.

As electrification continues to transform industries such as e-mobility and industrial automation, temperature sensors must deliver more than accurate measurements, they must withstand vibration, moisture, and demanding operating conditions while maintaining reliable performance. The YAGEO Group EC Flat-Series has been designed to meet these requirements

Elmos Semiconductor SE, a supplier of mixed-signal semiconductors for the automotive industry, and its South Korean silicon foundry partner, SK keyfoundry, signed an agreement to expand their collaboration during a signing ceremony in Frankfurt am Main. With the new agreement, Elmos secures long-term wafer capacity and ensures planning certainty through 2037.

At Automechanika Frankfurt 2026, ZF Aftermarket is underlining how electric mobility can become more serviceable for the independent aftermarket. With its Maintain-Repair-Replace approach, the company is enabling workshops to carry out targeted component-level repairs on electrified drivetrains, while OE-quality remanufactured options are available when replacement is the more appropriate route.

Infineon Technologies AG and SolarEdge Technologies, Inc., have announced an extension of their collaboration to advance solid-state circuit breaker (SSCB) technology for high-voltage DC distribution in AI and hyperscale data centers. The collaboration addresses a key challenge in the adoption of 800 VDC architecture: Safe operation of increasingly power-dense infrastructure requires a very fast fault-isolation to achieve selectivity while maintaining high efficiency.

Artificial Intelligence has fundamentally altered power dynamics within data centers. Unlike traditional workloads with slow and predictable power variations, modern AI creates “pulsed loads”, where processors switch rapidly between idle and full capacity. Power demand can swing from 0% to 100% and back in milliseconds, creating erratic “on-off” cycles that place power infrastructure under severe stress

Oxide layers, residues and process variation can undermine bonding, sintering and long-term reliability. Learn how controlled plasma processes create reproducible surface conditions for modern power electronics packaging.

This paper presents a novel optimization methodology for shared DC-link (SDCL) architectures in paralleled inverters, utilizing phase-shifted carrier PWM as well as a fast MATLAB-based current reconstruction method.

This paper presents a novel matched-lifetime sequencing methodology for power cycling tests, utilizing an AC power cycling test bench as well as a controlled mixed-stress protocol on 1.2 kV/150 A IGBT modules.

This paper presents the first industrialized 100 A / 800 V Smart Semiconductor Hybrid Circuit Breaker (SCHCB), utilizing a hybrid switching concept combining a high-speed mechanical arcing switch, a bidirectional power semiconductor switch, a robust voltage clamping circuit, and a mechanical isolation contact system.

Hitachi Energy and Daikin Industries, Ltd. has announced an agreement to establish a long-term strategic supply relationship for Hitachi Energy’s EconiQ portfolio of sulfur hexafluoride (SF6)-free high-voltage technologies. As part of the agreement, Daikin Chemical Europe GmbH, a subsidiary of Daikin Industries, Ltd., will supply C4-FN, a specialty gas component used in insulating gas mixtures.

Data centers consume enormous amounts of energy, more than 1.5% of the whole world. The power consumption is largely driven by servers and cooling solutions. Networking equipment, followed by storage, consumes less power than others, but innovative network packages can further reduce data center energy consumption. Enterprises are developing various solutions to combat high power consumption and distribution losses; one is to package optical components directly on the chip to reduce electricity bills. The solution is co-packaged optics (CPO), which combines fiber optics and networking at the chip level.

PMBus, the “power management bus,” isn’t a conductor or a device like a bus bar; it is a communications protocol layered on top of the system management bus (SMBus), which is based on another protocol known as inter-integrated circuit (I2C). In simple words, PMBus is a communications protocol that facilitates digital management of power supplies in data centers.

Photonic integrated circuits (PICs), also known as photonic chips, are a subject of research for many enterprises. In photonic chips, light does all the “work” of current. Light performs computing and signal processing faster than conventional chips. Emerging startups are developing efficient photonic chips to replace traditional silicon-based electronic integrated circuits (EICs) in data centers.

Hioki E.E. Corporation has developed a measurement standard that resolves a long-standing accuracy gap in high-frequency power calibration, delivering calibration accuracy approximately ten times greater than was previously achievable — including under methods used by national metrology institutes. By exploiting the physical principle that power losses ultimately manifest as heat, Hioki’s new calorimeter-based system detects heat generation as small as 0.01% of input apparent power, hardly dependent of operating frequency.

Replacing established silicon technology requires more than design alone. It requires proven reliability under real operating conditions. To ensure a new power supply can perform in demanding environments, particularly in medical and industrial systems, hardware must undergo extensive endurance testing before deployment.

Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.