onsemi has announced the launch of GaNEXUS, a new gallium nitride (GaN) power portfolio engineered to deliver higher efficiency, greater power density, and improved thermal performance across AI data centers, industrial automation, robotics, and energy infrastructure applications. The initial portfolio includes GaNEXUS FETs sampling across voltage ranges from 40V to 650V, including 650V GaNEXUS Smart, GaN FETs with integrated protection features, to simplify system integration and improve reliability.

Toshiba Electronic Devices & Storage Corporation has developed silicon carbide (SiC) power module technology for high-frequency inverter applications that delivers lower power loss and higher reliability. The technology combines Toshiba’s proprietary Schottky barrier diode (SBD) embedded SiC MOSFET with an optimized module design to realize high reliability and low loss operation during high-speed switching. Simulation results indicate that, under high-frequency inverter operation at 60kHz, total inverter power loss can be reduced by approximately 30% compared with a module using a conventional SBD-embedded SiC MOSFET structure.

Wolfspeed has introduced its fifth technology generation, demonstrating a substantial performance leap in efficiency for next-generation 1200 V and 750 V automotive and industrial applications. Wolfspeed’s Gen 5 technology was designed to holistically address those barriers and sets a new benchmark for specific on-resistance (RSP) — a core figure of merit for efficiency relative to the MOSFET's active die area.

The new GES High Voltage MX Series bridges the critical market gap between 15 kV and 20 kV DC for multi-pin HV connectors. Featuring a rugged brass housing and configurations up to 9 positions, it is the definitive answer to the increasing demands of mobile testing and industrial quality assurance.

True to the motto that ideas drive progress, the PCIM Conference Awards once again honored the best and the brightest during the opening ceremony of the PCIM Conference 2026. A total of five outstanding papers from industry and academia were recognized across three categories: the Best Paper Award, the Young Engineer Award, and the Young Researcher Award.

Greenconn announces updates to its high-speed interconnect product range and additions to its automotive connector portfolio. These developments address increasing requirements in European automotive electronics, industrial automation, and embedded systems.

At PCIM 2026, Mersen will present a data‑center‑dedicated portfolio addressing power management and thermal constraints across the entire infrastructure, from the grey room to the white room and down to rack and server level. The solutions shown at the booth are designed to support rising power density, higher DC voltages and the need for reliable, scalable, modular architectures.

MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460. The company will demonstrate how its latest attach materials help power electronics manufacturers improve reliability, improve process variation, and scale production more effectively.

As AI servers require higher power density and efficient PCB space utilization, power device packaging and switching characteristics become increasingly important. This whitepaper examines practical approaches using 600V SJ MOSFETs and TOLL packaging.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

Scientists at the Fraunhofer Institute for Solar Energy Systems ISE succeeded in breaking their own module record through an optimized interconnection of the solar cells. Their III-V germanium PV module thus achieves an efficiency of 34.4 percent. The solar cells were developed by AZUR SPACE, while the anti-reflective coatings on the front glass were provided by temicon. Visitors to Intersolar / The Smarter E 2026 can see the world’s most efficient PV module at Fraunhofer ISE’s booth A1.440.

Texas Instruments (TI) has introduced the industry's highest-cell-count battery monitor with an integrated electrochemical impedance spectroscopy (EIS) engine, bringing predictive intelligence, comprehensive data and real-time diagnostics to battery monitoring in electric vehicles (EV) and energy storage system (ESS) applications.

Infineon Technologies AG and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems. As part of the collaboration, Infineon will supply silicon carbide (SiC) power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers. This will enhance the efficiency, power density and reliability of Siemens' protection solution.

Data centers consume massive amounts of energy, between 1.5-3% of the world's total electricity demand. Power electronics, covering converter technologies, distribution buses, and cooling systems, is the backbone of modern AI-ruled data centers.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that a Renesas subsidiary has completed the acquisition of software developer Pictorus, based in Oakland, California. With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Keysight Technologies, launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family. The R&S FPL1044 is an industry first, delivering high-frequency performance up to 44 GHz at a price point previously unattainable in the market. The universal RTSA option empowers FPL users with powerful real-time analysis capabilities.