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HIGH FREQUENCY CLOCK
Microchip launches 1.2 V clock buffers for SoCS and FPGAs
DATA CENTER PSUs
Capacitors gain momentum in AI data center power
CAPACITORS
New vibration-proof aluminum electrolytic capacitors
PRECISION SENSORS
Temperature sensors: precision performance for high-demand applications
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WAFER CAPACITY
Elmos and SK keyfoundry expand their collaboration on 130nm technology
EV KITS
ZF aftermarket announces new EV repair kits and expanded portfolio
AI DATA CENTER
Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers
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AI SYSTEMS
Vertiv partners with Yokogawa for AI-ready UPS systems validation
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HIGH VOLTAGE GRID
Critical gas for sustainable high-voltage grids now made in Germany
DATA CENTERS
Co-packaged optics in data centers
DATA CENTER PSUs
PMBus: Telemetry in data center power supply units
SILICON PHOTONICS
Photonic integrated circuits might replace silicon chips in data centers
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MEASUREMENT TOOLS
Hioki achieves tenfold advance in high-frequency power calibration
POWER TESTING
Laboratory testing regimens for advanced power design
DATA CENTER
Cadence accelerates digital twin–driven data center AI modernization with HPE
DEVELOPER TOOLS
Renesas acquires Pictorus to speed embedded software
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| May 5, 2026
Electronics Technician / Mechatronics Technician (m/f/d) – Testing Department
1
:quality(80)/p7i.vogel.de/wcms/99/dd/99dd64ae87c0855129bd405f61d81f81/0133290217v2.jpeg "Microchip’s new 1.2 V SY757xx clock buffers connect modern low-voltage SoCs, FPGAs and AI accelerators with higher-voltage clock components, supporting frequencies up to 250 MHz and additive jitter as low as 26 fs. (Source: Microchip)")
:quality(80)/p7i.vogel.de/wcms/83/d0/83d0b8ea52378c77f98358e29ceccfc0/0133339307v2.jpeg "Capacitors are a critical yet often overlooked component in AI data center power supplies, buffering energy and stabilizing voltage as racks scale toward the megawatt range. (Source: © Parilov - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/10/fc/10fcb98e44d61826e641bc8d3f20f616/0133193677v2.jpeg "The new AEVA and AEVB Series aluminum electrolytic capacitors are engineered for harsh industrial environments, delivering high-CV, long-lifetime performance in compact, surface-mount packages that reliably withstand up to 30g acceleration and operating temperatures extending from -55° to +125°C. (Source: Kyocera)")
:quality(80)/p7i.vogel.de/wcms/f7/42/f74208db9f5f87dca384b38b71c4782e/0133196365v2.jpeg "YAGEO’s EC Flat‑Series temperature sensors combine fast, accurate measurement with resistance to vibration, shock, moisture and dust for demanding automotive and industrial applications. (Source: Yageo)")
:quality(80)/p7i.vogel.de/wcms/57/b6/57b6d33cb929fa4408ad56803ed5f0bc/0133311998v2.jpeg "Elmos and SK keyfoundry are expanding their collaboration on 130 nm technology and have agreed on long-term wafer capacity through 2037 to support reliable automotive semiconductor production. (Source: © remake - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/b4/0a/b40a1de3c8fa631b2aff74ec436c43db/0133314066v2.jpeg "ZF Aftermarket expands its EV service portfolio with new repair kits and solutions for e‑motors, inverters, hybrid modules, mechatronics and electric drive units. (Source: ZF Aftermarket)")
:quality(80)/p7i.vogel.de/wcms/48/e1/48e107b92f976652532facf5ca1e0855/0133290826v2.jpeg "Infineon and SolarEdge are extending their collaboration to develop solid-state protection solutions for 800 VDC AI data centers, aiming to improve fault response, system reliability and power density. (Source: © Grispb - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/99/84/9984f5888ecc71c249f65cea3f0658d1/0133069650v2.jpeg "Yokogawa’s integrated measurement setup helps Vertiv analyse AI-driven pulsed loads, combining power, waveform and thermal data to validate UPS performance and input power smoothing. (Source: YOKOGAWA)")
:quality(80)/p7i.vogel.de/wcms/a4/29/a429b944eb0a69e268015f8300ba8940/0133311989v2.jpeg "Hitachi Energy and Daikin are establishing a German supply of C4‑FN, a specialty insulating gas used in SF₆‑free high‑voltage equipment for more sustainable power grids. (Source: © Ahmed - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/d5/32/d5326e4b05d5cd759e88062f1c0b097a/0133344193v2.jpeg "Co-packaged optics is the latest innovation in data centers where optical modules on silicon chips can assist in scaling megawatt AI infrastructure. (Source: © Rachakrit - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/76/a9/76a9333bc7c6abbf7e29d1b910edb5e2/0133335959v2.jpeg "This article explains PMBus in data center power supplies. (Source: © Gibster - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/35/9c/359cfb6c855204e4d114f88cf5b98b5f/0133078984v2.jpeg "Photonic integrated circuits are next-level chips that will dominate data centers in the upcoming years. (Source: © pier - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/af/7f/af7f7b0fb7f29219fc991b1130f65477/0132241333v2.jpeg "Comprehensive laboratory testing regimens—combining thermal cycling, high‑current stress, EMC, and accelerated lifetime tests—are essential to validate advanced power designs and ensure reliability in real‑world applications. (Source: PRBX)")
:quality(80)/p7i.vogel.de/wcms/16/3d/163df69363f8125315a9826e13ea4b05/0131927425v2.jpeg "Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure. (Source: Cadence)")
:quality(80)/p7i.vogel.de/wcms/85/b7/85b7e90733a2bd8f21515d8f7137f2fc/0131917677v2.jpeg "Renesas acquires Pictorus to integrate its embedded application software platform with Renesas’ MCU and MPU portfolio, helping developers shorten time‑to‑market and simplify system integration. (Source: © lucadp - stock.adobe.com)")
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