:quality(80)/p7i.vogel.de/wcms/2f/f3/2ff3221bf7665de2d0acf83760bfd1fa/0130031523v2.jpeg "Wolfspeed presents a 300 mm silicon carbide technology platform designed to support advanced packaging and high-efficiency power delivery for AI data center infrastructure. (Source: Wolfspeed)")
:quality(80)/p7i.vogel.de/wcms/c3/16/c316e955a97f5d72d9678297b237b9e5/0129932858v2.jpeg "Left: the single-phase version of the SENTRON ECPD with RCM, right: a model of the future three-phase version of the SENTRON ECPD. (Source: Siemens)")
:quality(80)/p7i.vogel.de/wcms/ef/0a/ef0adb0acf793fe147cc27c21f6a7a67/0129954238v2.jpeg "Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image) (Source: © IF.arc - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/53/f9/53f9301dfc9292d02960f7996c79cc6e/0129927601v2.jpeg "Wolfspeed’s new 10 kV SiC MOSFET enables high-voltage power conversion for grid and industrial applications. (symbolic image) (Source: © ＣＲＥＡＴＩＶＥ- 3.4 - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/6e/cd/6ecd41d095d5111cf4ed37b714844487/0129930878v2.jpeg "PCIM Asia Shenzhen provides a platform for industry experts to present new developments in power electronics and electrification technologies. (symbolic image) (Source: © killykoon - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/02/c0/02c0e9722f70b1134dbf96fb59a9c73d/0129655179v2.jpeg "The PCIM Conference 2026 will take place from June 9-11, featuring discussions on power electronics trends, including GaN technology and AI applications. (symbolic image) (Source: © Elmira - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/cc/67/cc670ea2029cd2af5c641af70e1bf734/0129816392v4.jpeg "Fraunhofer IAF coordinates the EU SUPREME project to accelerate GaN and SiC power semiconductor innovation in Europe. (Source: Fraunhofer IAF)")
:quality(80)/p7i.vogel.de/wcms/ea/e6/eae6aee30071e67a5627027974437134/0129544613v2.jpeg "GlobalFoundries and Renesas strengthen their collaboration to support U.S.-based semiconductor production and supply chain resilience. (Source: © ronstik - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/b1/5e/b15ee02b0ba02db70cf61e37d66ad1d3/0129349127v2.jpeg "Vehicle-to-grid (V2G) chargers enable bidirectional energy flow, allowing electric vehicles to act as mobile energy storage systems that can both draw power from and feed power back into the grid. (Source: © medienvirus - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/26/d5/26d591cc340077026eac56a0e7564faf/0129949603v2.jpeg "Flexible: The solid silicone-based electrolyte is elastic, thereby compensating for the voids that form in solid-state batteries during charging and discharging. (Source: Empa)")
:quality(80)/p7i.vogel.de/wcms/4d/e0/4de02f76a37cbb3df30dd231de589c8e/0128866890v2.jpeg "Both legacy and vGaN show higher carrier mobility and band gap energies compared to other power semiconductors. (Source: © phonlamaiphoto - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/18/0b/180b7b63afc91e523592d8a5ce161c96/0129847487v2.jpeg "InGaAs-based photodetectors enable sensitive and fast detection in the short-wave infrared spectrum for modern sensing and communication applications. (Source: © VITALII - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/be/c8/bec8d43fc0ee73414274be44608b2970/0129748903v2.jpeg "The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)")
:quality(80)/p7i.vogel.de/wcms/23/ee/23ee4a97790d6009dbfd7d9577ffa723/0129220424v2.jpeg "The R&S FPL1044 with the new RTSA option makes 40 MHz real-time frequency analysis available up to 44 GHz. (Source: Rohde & Schwarz )")
:quality(80)/p7i.vogel.de/wcms/3c/d1/3cd1cacbceb792ba63727199c61ca434/0127801860v2.jpeg "Thanks to cloud technology, users can collaborate on projects from anywhere and always have access to the latest planning data. (Source: SIEMENS)")
:quality(80)/p7i.vogel.de/wcms/5a/a0/5aa0436498af618297961fd54ab36cdf/0126290792v2.jpeg "Siemens accelerates student-led semiconductor innovation across Europe’s leading technical universities through Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton (Source: Siemens Digital Industries Software)")
/thumbor.vogel.de/wiWq2t-xgNLbB2eSjg0ZBBQlLK4=/1200x0/filters:format(png):upscale(1)/p7i.vogel.de/companies/68/52/68526d7ad766e/r-carousel-banner-pcim-1500x400-v1.jpeg)
:quality(80)/images.vogel.de/vogelonline/bdb/1843100/1843109/original.jpg?v= "Key Foundry's Gen2 flash memory embedded 0.13 micron BCD (Bipolar-CMOS-DMOS) process is suitable for automotive power semiconductors. (Public Domain)")
:fill(fff,0)/p7i.vogel.de/companies/60/7e/607ec89d5d9b5/white-frame.jpg "white frame.jpg (www.rohm.com)")
:quality(80)/p7i.vogel.de/wcms/2f/c5/2fc55f62884763b5427ad26a74add937/97126563.jpeg?v= "The Chinese company BYD Co Ltd. is now fighting Infineon in the production of semiconductors and is now a serious competitor. (Source: gemeinfrei)")
Article | Jun 16, 2021
China’s BYD launches new automotive chip; competes with Infineon
:quality(80)/images.vogel.de/vogelonline/bdb/1838300/1838368/original.jpg?v= "Row of 2 nm nanosheet devices (IBM)")
Article | Jun 4, 2021
IBM unveils world's first 2 nanometer chip technology
:quality(80)/images.vogel.de/vogelonline/bdb/1837400/1837449/original.jpg?v= "Solving the gate breakdown voltage problem of GaN devices contributes to lower power consumption and greater miniaturization of power supplies for base stations and data centers. (Rohm)")
Article | Jun 3, 2021
ROHM’s 8V breakthrough for 150V GaN HEMT
:quality(80)/p7i.vogel.de/wcms/51/b9/51b94606267f3b3ac372f7f20106270e/96934441.jpeg?v= "Several perovskite consortiums have been formed in recent years, including US-MAP and EPKI. (Source: gemeinfrei)")
Article | Jun 2, 2021
Tin halide: Paving the way for lead-free perovskites
:quality(80)/images.vogel.de/vogelonline/bdb/1836700/1836765/original.jpg?v= "Fortify and Rogers Corporation oartner to develop 3D printed dielectric material systems for radio frequency devices (gemeinfrei)")
Article | Jun 1, 2021
Fortify and Rogers partner to develop 3D printed dielectric material systems
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Article | May 31, 2021
Collaboration on AI processing based 3D sensing for next-gen AIoT devices
:quality(80)/images.vogel.de/vogelonline/bdb/1837800/1837845/original.jpg?v= "Project SUPERSMART: Printed sensors on paper - a new and sustainable solution for smart labeling. (SUPERSMART project)")
Article | May 28, 2021
SUPERSMART – paper-based printed electronics
:quality(80)/images.vogel.de/vogelonline/bdb/1838100/1838119/original.jpg?v= "Prototype of the solar cells in laboratory size (TPC - Transparent Passivating Contact). Four solar cells, each measuring four square centimeters, can be seen on the silicon wafer, each of which is contacted and framed with screen-printed silver contacts. (Forschungszentrum Jülich )")
Article | May 27, 2021
Transparent nanolayers for more solar power
:quality(80)/p7i.vogel.de/wcms/ac/c6/acc69b572603f02f24280aea5cdba9b2/96788278.jpeg?v= "Deciding which PCB design software package is best depends very much on your personal perspective: the complexity and size of your project, your budget, your expertise, and whether you are working alone or as part of a team are all factors. (Source: ©Lev - stock.adobe.com)")