:quality(80)/p7i.vogel.de/wcms/e9/5b/e95bc9c43c57018499c83a2c91ff9764/0132237640v2.jpeg "Yageo’s KH‑AT series automotive‑grade MOVs deliver robust surge absorption and stable electrical performance for demanding vehicle environments, protecting ECUs and power rails from transients. (Source: Yageo)")
:quality(80)/p7i.vogel.de/wcms/f4/61/f461d1f6bf3a6030877d90efced438f2/0132110372v2.jpeg "Taiyo Yuden’s new HVX and HTX hybrid conductive‑polymer capacitors offer AEC‑Q200 qualification, 80 V rating and high ripple capability at 135°C for noise suppression and power smoothing in automotive systems such as ADAS and power steering. (Source: Taiyo Yuden)")
:quality(80)/p7i.vogel.de/wcms/a4/b6/a4b6256bef45368325659f926c268ebe/0132104622v2.jpeg "Toshiba’s new 80 V N‑channel power MOSFET, built on the company’s latest process, improves conduction and switching efficiency for AI server power supplies and high‑frequency data‑center converters. (Source: Toshiba)")
:quality(80)/p7i.vogel.de/wcms/c0/c5/c0c5bdbaf6df6fdd0fecc97c419ea9b4/0132022612v2.jpeg "Magnachip’s 6th‑generation 600 V super‑junction MOSFETs deliver improved efficiency and thermal performance for AI server power supplies and EV fast‑charging systems. (Source: © AntonKhrupinArt - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/51/72/51726a890dc35d74f494908b29681028/0132478976v2.jpeg "Bosch intends to start U.S. based commercial manufacturing in 2026 – just three years after acquiring the Roseville site. (Source: Bosch)")
:quality(80)/p7i.vogel.de/wcms/cc/f5/ccf52ac525f49330b780868db8f9565c/0132364990v2.jpeg "Infineon and LS ELECTRIC sign a memorandum to co‑develop high‑efficiency DC power infrastructure for AI data centers and next‑generation grids, targeting power conversion, energy storage integration, solid‑state transformers and semiconductor circuit breakers. (Source: © Yuliia - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/c6/16/c616f00139ce1575d3292524579868ed/0132241890v2.jpeg "GlobalWafers and Micron announce a strategic collaboration—including proposed financing support and a long‑term wafer supply agreement—to strengthen U.S. wafer manufacturing capacity and shore up the semiconductor supply chain for AI and data‑center demand. (Source: © Fervix Neon - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/ef/6d/ef6da8753871e0ea5c7b7203d31b2c9c/0132144857v2.jpeg "Keysight and WIN Semiconductor partner to reduce design risk for high‑frequency RF components by combining advanced measurement and modeling workflows with foundry‑level device validation for mmWave and high‑frequency applications. (symbolic image) (Source: © Mahmuda - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/83/ae/83ae0b00e573da9977ce19195d28c6b0/0132366058v2.jpeg "Researchers from EPC, The University of Hong Kong and Virginia Tech demonstrated a fully integrated GaN boost converter operating entirely at 4 K, achieving 91.6% efficiency at 7.6 W by combining monolithic GaN power ICs, on‑chip gate drivers and cryo‑qualified passive components. (Source: © Maurizio Di Paolo Emilio)")
:quality(80)/p7i.vogel.de/wcms/3c/a1/3ca1e2527a00068eb37f1db220c5463a/0132042920v2.jpeg "Energy harvesting removes the need for periodic battery swaps in hard‑to‑reach sensors — economically and regulatorily attractive as EU battery rules raise compliance and lifecycle costs. (Source: © Plaifah - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/81/04/8104b7c9a2ce5645d844ca4a1b9a736f/0132261940v2.jpeg "At The Smarter E 2026 Huawei launched LUTERRA, its next‑generation grid‑forming ESS platform, and showcased the award‑winning SUN2000‑506KTL 506 kW smart string inverter — technologies aimed at 1000 Vac architectures and plant‑level grid‑forming functionality. (Source: © Thares2020 - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/76/27/7627729494f2cddf62d276e5d6cd0aa1/0132245568v2.jpeg "Aluminum nitride crystal with a diameter of 2 inches – grown in the Joint Lab of Fraunhofer IISB and PVA TePla. (Source: Jennifer Reißig / Fraunhofer IISB)")
:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/af/7f/af7f7b0fb7f29219fc991b1130f65477/0132241333v2.jpeg "Comprehensive laboratory testing regimens—combining thermal cycling, high‑current stress, EMC, and accelerated lifetime tests—are essential to validate advanced power designs and ensure reliability in real‑world applications. (Source: PRBX)")
:quality(80)/p7i.vogel.de/wcms/16/3d/163df69363f8125315a9826e13ea4b05/0131927425v2.jpeg "Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure. (Source: Cadence)")
:quality(80)/p7i.vogel.de/wcms/85/b7/85b7e90733a2bd8f21515d8f7137f2fc/0131917677v2.jpeg "Renesas acquires Pictorus to integrate its embedded application software platform with Renesas’ MCU and MPU portfolio, helping developers shorten time‑to‑market and simplify system integration. (Source: © lucadp - stock.adobe.com)")
/thumbor.vogel.de/NW6SUhFH4CM4OPNj-Zqgr5T8jpE=/1200x0/filters:format(png):upscale(1)/p7i.vogel.de/companies/6a/1e/6a1ef531d7581/firmenprofil-1.jpeg)
:quality(80)/images.vogel.de/vogelonline/bdb/1843900/1843920/original.jpg?v= "According to a research report by Mordor Intelligence LLP, the global solar energy installed capacity is registered to be 728 GW and is estimated to grow to 1645 gigawatts (GW) in 2026, while growing at a CAGR of 13.78% from 2021 to 2026. (gemeinfrei)")
:fill(fff,0)/p7i.vogel.de/companies/60/7e/607ec89d5d9b5/white-frame.jpg "white frame.jpg (www.rohm.com)")
:quality(80)/images.vogel.de/vogelonline/bdb/1843300/1843397/original.jpg?v= "Nexperia wafer fab in Germany, Hamburg. (Nexperia)")
Article | Jun 17, 2021
Nexperia invests $700 million in 2021/2022 to boost production capacity
:quality(80)/images.vogel.de/vogelonline/bdb/1842500/1842544/original.jpg?v= "AMD's new 3D chiplet technology, developed in partnership with TSMC. (AMD)")
Article | Jun 17, 2021
AMD may have unveiled the future of processors
:quality(80)/p7i.vogel.de/wcms/a2/ff/a2ff000af92482225b1c854f8b3c67d4/97155317.jpeg?v= "With increasing switching speeds enabled by SiC power MOSFETs, fast rise and fall times during switching transients are desirable to reduce the anticipated hard-switching losses. (Source: Andrei Kuzmik - stock.adobe.com)")
Article | Jun 17, 2021
An adaptive SiC MOSFET gate driver
:quality(80)/images.vogel.de/vogelonline/bdb/1843100/1843109/original.jpg?v= "Key Foundry's Gen2 flash memory embedded 0.13 micron BCD (Bipolar-CMOS-DMOS) process is suitable for automotive power semiconductors. (Public Domain)")
Article | Jun 16, 2021
Innovative 0.13-micron BCD process for automotive power semiconductors unveiled
:quality(80)/p7i.vogel.de/wcms/2f/c5/2fc55f62884763b5427ad26a74add937/97126563.jpeg?v= "The Chinese company BYD Co Ltd. is now fighting Infineon in the production of semiconductors and is now a serious competitor. (Source: gemeinfrei)")
Article | Jun 16, 2021
China’s BYD launches new automotive chip; competes with Infineon
:quality(80)/images.vogel.de/vogelonline/bdb/1838300/1838368/original.jpg?v= "Row of 2 nm nanosheet devices (IBM)")
Article | Jun 4, 2021
IBM unveils world's first 2 nanometer chip technology
:quality(80)/images.vogel.de/vogelonline/bdb/1837400/1837449/original.jpg?v= "Solving the gate breakdown voltage problem of GaN devices contributes to lower power consumption and greater miniaturization of power supplies for base stations and data centers. (Rohm)")
Article | Jun 3, 2021
ROHM’s 8V breakthrough for 150V GaN HEMT
:quality(80)/p7i.vogel.de/wcms/51/b9/51b94606267f3b3ac372f7f20106270e/96934441.jpeg?v= "Several perovskite consortiums have been formed in recent years, including US-MAP and EPKI. (Source: gemeinfrei)")
Article | Jun 2, 2021
Tin halide: Paving the way for lead-free perovskites
:quality(80)/images.vogel.de/vogelonline/bdb/1836700/1836765/original.jpg?v= "Fortify and Rogers Corporation oartner to develop 3D printed dielectric material systems for radio frequency devices (gemeinfrei)")