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:quality(80)/p7i.vogel.de/wcms/8c/c3/8cc3f77472b8af8ca61b5bf8cb7ee8f0/0131704631v2.jpeg "ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support (Source: ROHM)")
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:quality(80)/p7i.vogel.de/wcms/93/fa/93fac0d35290aa5065c18e0a132517c1/0131665788v2.jpeg "The new high performance fuses from Mersen combine the best AC/DC electrical characteristics in a single compact housing (Source: Mersen)")
:quality(80)/p7i.vogel.de/wcms/b5/58/b55874104bf128af36ab420983a1a74f/0131625728v2.jpeg "GC01 (0.5 mm pitch) delivers floating, tolerance‑compensating board‑to‑board performance for high‑speed applications; GB05 provides secure wire‑to‑board connections for automotive and industrial systems. (Source: © WrightStudio - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/e3/a2/e3a2c363179aa46339ba27d0a1785217/0131622335v2.jpeg "At PCIM 2026 Mersen presents new electrical protection solutions for data centers. (Source: © nerminmuminovic - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/df/de/dfde53ac2f23feddfb142593b89981ed/0131617862v2.jpeg "Advanced die‑attach and solder preform solutions from MacDermid Alpha enable more repeatable manufacturing and higher reliability for automotive, industrial and AI data‑center power modules. (Source: MacDermid Alpha)")
:quality(80)/p7i.vogel.de/wcms/eb/0c/eb0c8cf409c67fd4fc2d73b7c507a015/0131581571v2.jpeg "The PCIM Executive Circle brings together selected industry leaders for strategic dialogue on market trends, technological challenges and the future of power electronics. (Source: PCIM)")
:quality(80)/p7i.vogel.de/wcms/5c/f5/5cf53b6db2706b86ac6eb5c407704d27/0131699647v2.jpeg "This article explains inductors in electrical and electronics engineering. (Source: © Iurii - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/e8/b1/e8b1b3c2722724a07ec9835292cf568e/0131681282v2.jpeg "STMicroelectronics expands its PowerGaN portfolio with 700 V HEMTs (6–29 A, 53–270 mΩ typ.), delivering lower switching and conduction losses to increase efficiency and power density for AI servers, robotics and industrial power supplies. (Source: STMicroelectronics)")
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:quality(80)/p7i.vogel.de/wcms/34/4a/344a3dc5a19429cf6726b7f8f7e2ee32/0130109719v2.jpeg "Hioki’s new measurement solutions enable precise analysis of power electronics systems and energy efficiency. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/be/c8/bec8d43fc0ee73414274be44608b2970/0129748903v2.jpeg "The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)")
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:quality(80)/p7i.vogel.de/wcms/32/ee/32ee82e6bb9cc5ebe2cd5fe0ec7bdb85/97180742.jpeg?v= "Some automotive and audio applications require, in addition to traditional voltage sources, power supplies that can function as a load and sinking current from the output terminals. (Source: ©jeff Metzger - stock.adobe.com)")
:fill(fff,0)/p7i.vogel.de/companies/60/7e/607ec89d5d9b5/white-frame.jpg "white frame.jpg (www.rohm.com)")
:quality(80)/images.vogel.de/vogelonline/bdb/1843900/1843920/original.jpg?v= "According to a research report by Mordor Intelligence LLP, the global solar energy installed capacity is registered to be 728 GW and is estimated to grow to 1645 gigawatts (GW) in 2026, while growing at a CAGR of 13.78% from 2021 to 2026. (gemeinfrei)")
Article | Jun 18, 2021
The solar energy segment looks set to continue its expansion
:quality(80)/images.vogel.de/vogelonline/bdb/1843300/1843397/original.jpg?v= "Nexperia wafer fab in Germany, Hamburg. (Nexperia)")
Article | Jun 17, 2021
Nexperia invests $700 million in 2021/2022 to boost production capacity
:quality(80)/images.vogel.de/vogelonline/bdb/1842500/1842544/original.jpg?v= "AMD's new 3D chiplet technology, developed in partnership with TSMC. (AMD)")
Article | Jun 17, 2021
AMD may have unveiled the future of processors
:quality(80)/p7i.vogel.de/wcms/a2/ff/a2ff000af92482225b1c854f8b3c67d4/97155317.jpeg?v= "With increasing switching speeds enabled by SiC power MOSFETs, fast rise and fall times during switching transients are desirable to reduce the anticipated hard-switching losses. (Source: Andrei Kuzmik - stock.adobe.com)")
Article | Jun 17, 2021
An adaptive SiC MOSFET gate driver
:quality(80)/images.vogel.de/vogelonline/bdb/1843100/1843109/original.jpg?v= "Key Foundry's Gen2 flash memory embedded 0.13 micron BCD (Bipolar-CMOS-DMOS) process is suitable for automotive power semiconductors. (Public Domain)")
Article | Jun 16, 2021
Innovative 0.13-micron BCD process for automotive power semiconductors unveiled
:quality(80)/p7i.vogel.de/wcms/2f/c5/2fc55f62884763b5427ad26a74add937/97126563.jpeg?v= "The Chinese company BYD Co Ltd. is now fighting Infineon in the production of semiconductors and is now a serious competitor. (Source: gemeinfrei)")
Article | Jun 16, 2021
China’s BYD launches new automotive chip; competes with Infineon
:quality(80)/images.vogel.de/vogelonline/bdb/1838300/1838368/original.jpg?v= "Row of 2 nm nanosheet devices (IBM)")
Article | Jun 4, 2021
IBM unveils world's first 2 nanometer chip technology
:quality(80)/images.vogel.de/vogelonline/bdb/1837400/1837449/original.jpg?v= "Solving the gate breakdown voltage problem of GaN devices contributes to lower power consumption and greater miniaturization of power supplies for base stations and data centers. (Rohm)")
Article | Jun 3, 2021
ROHM’s 8V breakthrough for 150V GaN HEMT
:quality(80)/p7i.vogel.de/wcms/51/b9/51b94606267f3b3ac372f7f20106270e/96934441.jpeg?v= "Several perovskite consortiums have been formed in recent years, including US-MAP and EPKI. (Source: gemeinfrei)")