:quality(80)/p7i.vogel.de/wcms/2f/f3/2ff3221bf7665de2d0acf83760bfd1fa/0130031523v2.jpeg "Wolfspeed presents a 300 mm silicon carbide technology platform designed to support advanced packaging and high-efficiency power delivery for AI data center infrastructure. (Source: Wolfspeed)")
:quality(80)/p7i.vogel.de/wcms/c3/16/c316e955a97f5d72d9678297b237b9e5/0129932858v2.jpeg "Left: the single-phase version of the SENTRON ECPD with RCM, right: a model of the future three-phase version of the SENTRON ECPD. (Source: Siemens)")
:quality(80)/p7i.vogel.de/wcms/ef/0a/ef0adb0acf793fe147cc27c21f6a7a67/0129954238v2.jpeg "Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image) (Source: © IF.arc - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/53/f9/53f9301dfc9292d02960f7996c79cc6e/0129927601v2.jpeg "Wolfspeed’s new 10 kV SiC MOSFET enables high-voltage power conversion for grid and industrial applications. (symbolic image) (Source: © ＣＲＥＡＴＩＶＥ- 3.4 - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/6e/cd/6ecd41d095d5111cf4ed37b714844487/0129930878v2.jpeg "PCIM Asia Shenzhen provides a platform for industry experts to present new developments in power electronics and electrification technologies. (symbolic image) (Source: © killykoon - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/02/c0/02c0e9722f70b1134dbf96fb59a9c73d/0129655179v2.jpeg "The PCIM Conference 2026 will take place from June 9-11, featuring discussions on power electronics trends, including GaN technology and AI applications. (symbolic image) (Source: © Elmira - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/cc/67/cc670ea2029cd2af5c641af70e1bf734/0129816392v4.jpeg "Fraunhofer IAF coordinates the EU SUPREME project to accelerate GaN and SiC power semiconductor innovation in Europe. (Source: Fraunhofer IAF)")
:quality(80)/p7i.vogel.de/wcms/ea/e6/eae6aee30071e67a5627027974437134/0129544613v2.jpeg "GlobalFoundries and Renesas strengthen their collaboration to support U.S.-based semiconductor production and supply chain resilience. (Source: © ronstik - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/3c/4b/3c4bbc68dda65c7071b4376fb57423b0/0130030465v2.jpeg "Faraday’s laws explain the fundamental behavior of magnetic fields and electronic devices in dynamic use cases. The operation of transformers, wireless chargers, induction cookers, induction motors, magnetic levitating trains (MAGLEV Trains), electric violin, and many others depends upon Faraday’s laws. (Source: © Sheraz - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/b1/5e/b15ee02b0ba02db70cf61e37d66ad1d3/0129349127v2.jpeg "Vehicle-to-grid (V2G) chargers enable bidirectional energy flow, allowing electric vehicles to act as mobile energy storage systems that can both draw power from and feed power back into the grid. (Source: © medienvirus - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/26/d5/26d591cc340077026eac56a0e7564faf/0129949603v2.jpeg "Flexible: The solid silicone-based electrolyte is elastic, thereby compensating for the voids that form in solid-state batteries during charging and discharging. (Source: Empa)")
:quality(80)/p7i.vogel.de/wcms/4d/e0/4de02f76a37cbb3df30dd231de589c8e/0128866890v2.jpeg "Both legacy and vGaN show higher carrier mobility and band gap energies compared to other power semiconductors. (Source: © phonlamaiphoto - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/be/c8/bec8d43fc0ee73414274be44608b2970/0129748903v2.jpeg "The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)")
:quality(80)/p7i.vogel.de/wcms/23/ee/23ee4a97790d6009dbfd7d9577ffa723/0129220424v2.jpeg "The R&S FPL1044 with the new RTSA option makes 40 MHz real-time frequency analysis available up to 44 GHz. (Source: Rohde & Schwarz )")
:quality(80)/p7i.vogel.de/wcms/3c/d1/3cd1cacbceb792ba63727199c61ca434/0127801860v2.jpeg "Thanks to cloud technology, users can collaborate on projects from anywhere and always have access to the latest planning data. (Source: SIEMENS)")
:quality(80)/p7i.vogel.de/wcms/5a/a0/5aa0436498af618297961fd54ab36cdf/0126290792v2.jpeg "Siemens accelerates student-led semiconductor innovation across Europe’s leading technical universities through Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton (Source: Siemens Digital Industries Software)")
/thumbor.vogel.de/wiWq2t-xgNLbB2eSjg0ZBBQlLK4=/1200x0/filters:format(png):upscale(1)/p7i.vogel.de/companies/68/52/68526d7ad766e/r-carousel-banner-pcim-1500x400-v1.jpeg)
:quality(80)/images.vogel.de/vogelonline/bdb/1842500/1842544/original.jpg?v= "AMD's new 3D chiplet technology, developed in partnership with TSMC. (AMD)")
:fill(fff,0)/p7i.vogel.de/companies/60/7e/607ec89d5d9b5/white-frame.jpg "white frame.jpg (www.rohm.com)")
:quality(80)/p7i.vogel.de/wcms/a2/ff/a2ff000af92482225b1c854f8b3c67d4/97155317.jpeg?v= "With increasing switching speeds enabled by SiC power MOSFETs, fast rise and fall times during switching transients are desirable to reduce the anticipated hard-switching losses. (Source: Andrei Kuzmik - stock.adobe.com)")
Article | Jun 17, 2021
An adaptive SiC MOSFET gate driver
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Article | Jun 16, 2021
Innovative 0.13-micron BCD process for automotive power semiconductors unveiled
:quality(80)/p7i.vogel.de/wcms/2f/c5/2fc55f62884763b5427ad26a74add937/97126563.jpeg?v= "The Chinese company BYD Co Ltd. is now fighting Infineon in the production of semiconductors and is now a serious competitor. (Source: gemeinfrei)")
Article | Jun 16, 2021
China’s BYD launches new automotive chip; competes with Infineon
:quality(80)/images.vogel.de/vogelonline/bdb/1838300/1838368/original.jpg?v= "Row of 2 nm nanosheet devices (IBM)")
Article | Jun 4, 2021
IBM unveils world's first 2 nanometer chip technology
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Article | Jun 3, 2021
ROHM’s 8V breakthrough for 150V GaN HEMT
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Article | Jun 2, 2021
Tin halide: Paving the way for lead-free perovskites
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Article | Jun 1, 2021
Fortify and Rogers partner to develop 3D printed dielectric material systems
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Article | May 31, 2021
Collaboration on AI processing based 3D sensing for next-gen AIoT devices
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