:quality(80)/p7i.vogel.de/wcms/e9/5b/e95bc9c43c57018499c83a2c91ff9764/0132237640v2.jpeg "Yageo’s KH‑AT series automotive‑grade MOVs deliver robust surge absorption and stable electrical performance for demanding vehicle environments, protecting ECUs and power rails from transients. (Source: Yageo)")
:quality(80)/p7i.vogel.de/wcms/f4/61/f461d1f6bf3a6030877d90efced438f2/0132110372v2.jpeg "Taiyo Yuden’s new HVX and HTX hybrid conductive‑polymer capacitors offer AEC‑Q200 qualification, 80 V rating and high ripple capability at 135°C for noise suppression and power smoothing in automotive systems such as ADAS and power steering. (Source: Taiyo Yuden)")
:quality(80)/p7i.vogel.de/wcms/a4/b6/a4b6256bef45368325659f926c268ebe/0132104622v2.jpeg "Toshiba’s new 80 V N‑channel power MOSFET, built on the company’s latest process, improves conduction and switching efficiency for AI server power supplies and high‑frequency data‑center converters. (Source: Toshiba)")
:quality(80)/p7i.vogel.de/wcms/c0/c5/c0c5bdbaf6df6fdd0fecc97c419ea9b4/0132022612v2.jpeg "Magnachip’s 6th‑generation 600 V super‑junction MOSFETs deliver improved efficiency and thermal performance for AI server power supplies and EV fast‑charging systems. (Source: © AntonKhrupinArt - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/51/72/51726a890dc35d74f494908b29681028/0132478976v2.jpeg "Bosch intends to start U.S. based commercial manufacturing in 2026 – just three years after acquiring the Roseville site. (Source: Bosch)")
:quality(80)/p7i.vogel.de/wcms/cc/f5/ccf52ac525f49330b780868db8f9565c/0132364990v2.jpeg "Infineon and LS ELECTRIC sign a memorandum to co‑develop high‑efficiency DC power infrastructure for AI data centers and next‑generation grids, targeting power conversion, energy storage integration, solid‑state transformers and semiconductor circuit breakers. (Source: © Yuliia - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/c6/16/c616f00139ce1575d3292524579868ed/0132241890v2.jpeg "GlobalWafers and Micron announce a strategic collaboration—including proposed financing support and a long‑term wafer supply agreement—to strengthen U.S. wafer manufacturing capacity and shore up the semiconductor supply chain for AI and data‑center demand. (Source: © Fervix Neon - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/ef/6d/ef6da8753871e0ea5c7b7203d31b2c9c/0132144857v2.jpeg "Keysight and WIN Semiconductor partner to reduce design risk for high‑frequency RF components by combining advanced measurement and modeling workflows with foundry‑level device validation for mmWave and high‑frequency applications. (symbolic image) (Source: © Mahmuda - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/83/ae/83ae0b00e573da9977ce19195d28c6b0/0132366058v2.jpeg "Researchers from EPC, The University of Hong Kong and Virginia Tech demonstrated a fully integrated GaN boost converter operating entirely at 4 K, achieving 91.6% efficiency at 7.6 W by combining monolithic GaN power ICs, on‑chip gate drivers and cryo‑qualified passive components. (Source: © Maurizio Di Paolo Emilio)")
:quality(80)/p7i.vogel.de/wcms/3c/a1/3ca1e2527a00068eb37f1db220c5463a/0132042920v2.jpeg "Energy harvesting removes the need for periodic battery swaps in hard‑to‑reach sensors — economically and regulatorily attractive as EU battery rules raise compliance and lifecycle costs. (Source: © Plaifah - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/81/04/8104b7c9a2ce5645d844ca4a1b9a736f/0132261940v2.jpeg "At The Smarter E 2026 Huawei launched LUTERRA, its next‑generation grid‑forming ESS platform, and showcased the award‑winning SUN2000‑506KTL 506 kW smart string inverter — technologies aimed at 1000 Vac architectures and plant‑level grid‑forming functionality. (Source: © Thares2020 - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/76/27/7627729494f2cddf62d276e5d6cd0aa1/0132245568v2.jpeg "Aluminum nitride crystal with a diameter of 2 inches – grown in the Joint Lab of Fraunhofer IISB and PVA TePla. (Source: Jennifer Reißig / Fraunhofer IISB)")
:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/af/7f/af7f7b0fb7f29219fc991b1130f65477/0132241333v2.jpeg "Comprehensive laboratory testing regimens—combining thermal cycling, high‑current stress, EMC, and accelerated lifetime tests—are essential to validate advanced power designs and ensure reliability in real‑world applications. (Source: PRBX)")
:quality(80)/p7i.vogel.de/wcms/16/3d/163df69363f8125315a9826e13ea4b05/0131927425v2.jpeg "Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure. (Source: Cadence)")
:quality(80)/p7i.vogel.de/wcms/85/b7/85b7e90733a2bd8f21515d8f7137f2fc/0131917677v2.jpeg "Renesas acquires Pictorus to integrate its embedded application software platform with Renesas’ MCU and MPU portfolio, helping developers shorten time‑to‑market and simplify system integration. (Source: © lucadp - stock.adobe.com)")
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:quality(80)/images.vogel.de/vogelonline/bdb/1796900/1796908/original.jpg?v= "Key Foundry starts mass production of Gen3 0.18 micron BCD process for mobile and automotive power semiconductors. (gemeinfrei)")
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:quality(80)/p7i.vogel.de/wcms/6c/60/6c606dfb9d3197280a282d641db15083/94581465.jpeg?v= "Researchers in the Oregon State University College of Engineering have developed a battery anode based on a new nanostructured alloy that could revolutionize the way energy storage devices are designed and manufactured. (Source: gemeinfrei)")
Article | Feb 15, 2021
Researchers develop a 3D alloy anode for battery storage
:quality(80)/images.vogel.de/vogelonline/bdb/1796300/1796355/original.jpg?v= "ROHM introduces a new ultra-compact side-emitting infrared LED, CSL1501RW. (gemeinfrei)")
Article | Feb 12, 2021
New power-saving infrared LED for VR/MR/AR applications
:quality(80)/p7i.vogel.de/wcms/27/91/27917d912ec4f9b2719098791c433c9b/94673362.jpeg?v= "Amber Solutions closes 2020 with Series B funding totaling more than $8.5 Million (Source: gemeinfrei)")
Article | Feb 11, 2021
Amber Solutions continues expansion in power management
:quality(80)/p7i.vogel.de/wcms/a6/a5/a6a5299ba430b40f2f7754186c8da5d5/94454208.jpeg?v= "Power over Ethernet (PoE) is a method of supplying network-compatible devices with power via the Ethernet cable. (Source: gemeinfrei)")
Article | Feb 10, 2021
Evolving Power over Ethernet accommodates higher-power devices
:quality(80)/p7i.vogel.de/wcms/78/ab/78ab007c5a9afe5e149ece9271c0e4f2/94417411.jpeg?v= "A mock-up of the Air-One site with a Hyundai eVTOL on top. (Source: Urban-Air Port Ltd)")
Article | Feb 5, 2021
UK to host world’s first airport for electric aircraft
:quality(80)/images.vogel.de/vogelonline/bdb/1791900/1791990/original.jpg?v= "The fluid heatsink FLKU 10 is made of a stainless austenitic steel (V4A) using a 3D printing process and contains a separate cooling circuit on each assembly side. (© Fischer Elektronik GmbH & Co. KG)")
Article | Feb 2, 2021
Efficient device cooling on the circuit board
:quality(80)/p7i.vogel.de/wcms/23/f6/23f6e9dda567ee54459978530a7f9e77/94294451.jpeg?v= "The automotive industry is suffering the consequences of the COVID-19 pandemic, as its demand for semiconductors cannot be met due to production disruptions. (Source: gemeinfrei)")
Article | Feb 1, 2021
Global chip shortage threatens auto industry supply chains
:quality(80)/images.vogel.de/vogelonline/bdb/1790900/1790955/original.jpg?v= "Booster power module. (DENSO)")
Article | Jan 29, 2021
New carbide power semiconductors for fuel cell vehicles
:quality(80)/p7i.vogel.de/wcms/56/c7/56c7406f1a71479af2526194c1d717bd/94164114.jpeg?v= "Swedish researchers from Chalmers University of Technology say that they’ve found a way to cool electronics and power systems using graphene-based heat pipes. (Source: gemeinfrei)")