EXPANDING BUSINESS
Nexperia invests $700 million in 2021/2022 to boost production capacity
PCIM EUROPE 2021 - 3. WINNER OF YOUNG ENGINEER AWARD
An adaptive SiC MOSFET gate driver
LIVE EVENT
Final countdown to the EBV Power Fair
AUTOMOTIVE CHIPS
China’s BYD launches new automotive chip; competes with Infineon
BATTERY
Better quality-control testing needed for EV batteries
ARTIFICIAL INTELLIGENCE
Bosch opens wafer fab of the future in Dresden
PCIM EUROPE DIGITAL DAYS 2021
All conference and forum presentations available on demand
PARTNERSHIP
Fortify and Rogers partner to develop 3D printed dielectric material systems
Galleries
3D SENSING
Collaboration on AI processing based 3D sensing for next-gen AIoT devices
KEYNOTE
PCIM 2021: HVDC grid challenges and opportunities
KEYNOTE
PCIM 2021: Next generation of power electronics module packaging
CHIP FACTORY
Six reasons why Bosch’s new wafer fab is one of the most modern factories