Industry News

This state-of-the-art facility features the first High NA EUV scanner, enabling early development of next-generation chips. Find out more here. (Source: Vera - stock.adobe.com)

Partnership to bring power devices based on Soitec’s cutting-edge SmartSiC™ silicon carbide wafers to X-FAB’s extensive fabless client network. (Source: Suralai - stock.adobe.com)

Catania Silicon Carbide Campus realizes ST’s plan for fully vertically integrated SiC capabilities from R&D to manufacturing, from substrate to module, on one site, enabling automotive and industrial customers in their shift to electrification and higher energy efficiency. (Source: STMicroelectronics)

At the European Forum in Amsterdam, TSMC’s EMEA President Paul de Bot announced that the company hopes to break ground on its Dresden facility by the end of the year. (Source: borevina - stock.adobe.com)

Read more about the current semiconductor industry strength in this article. (Source: Miha Creative - stock.adobe.com)

The semiconductor manufacturer has set an initial completion date of November 2025. (Source: VERTEX SPACE - stock.adobe.com)

This is a first: PCIM Europe 2024 is being expanded by another exhibition hall. In this exclusive interview, Lisette Hauser, Vice President PCIM Europe, explains how the trade fair has changed over time, what lessons have been learned and what she is particularly proud of. (Source: Mesago Messe Frankfurt GmbH)

The main reason for sending a chip-making machine to space is to understand the effect of microgravity on the fabrication process. Learn more about it in this article. (Source: Lidok_L - stock.adobe.com)

The PCIM Europe is an international exhibition and conference for power electronics, intelligent motion, renewable energy and energy management. The PCIM Europe will be held from 11 - 13 June 2024. (Source: Mesago / Uwe Mühlhäußer)

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