:quality(80)/p7i.vogel.de/wcms/7f/4b/7f4b97757cea82c0675209630577dc22/0133974130v2.jpeg "Vox Power’s EIRE600 delivers up to 600 W in a compact 5 × 3-inch package, with forced-air or conduction cooling options for industrial and medical equipment. (Source: Vox Power)")
:quality(80)/p7i.vogel.de/wcms/55/97/5597c3436e3bc92ee7ba23b6f9d289e9/0134032539v2.jpeg "Littelfuse’s TP7.0SMD-XC automotive TVS diode series uses foldback technology to provide low clamping voltage for protecting sensitive vehicle electronics. (Bild: Littelfuse)")
:quality(80)/p7i.vogel.de/wcms/51/f8/51f84448e666230bb11a02566abd1177/0133958187v3.jpeg "Microchip’s radiation-tolerant GaN point-of-load converter supplies up to 20 A for space-based processors, FPGAs, microcontrollers and ASICs. (Source: Microchip)")
:quality(80)/p7i.vogel.de/wcms/0a/7c/0a7c08f368ae1d91f758dd18d2a32e88/0133978423v2.jpeg "EPFL researchers have demonstrated a GaN transistor that withstands nearly 4 kV, using an intrinsic polarization superjunction design to distribute electric fields more evenly. (Source: EPFL)")
:quality(80)/p7i.vogel.de/wcms/5b/94/5b94232ca4183d6fcc2dccc7394d7544/0134041114v4.jpeg "Siemens and NVIDIA are testing AI applications at Siemens’ Erlangen electronics factory, using digital twins to support production planning and prepare inspection systems before physical prototypes are available. (Bild: Siemens)")
:quality(80)/p7i.vogel.de/wcms/b4/1f/b41f2731a07b608e60eca3663e280301/0133980549v2.jpeg "Multi-year agreement with Wolfspeed supports Infineon’s conversion from 150-millimeter to 200-millimeter silicon carbide (SiC) manufacturing (Source: © Ada - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/e3/0a/e30a8813bcf44b16f0dceb63a0747d29/0133984094v2.jpeg "The semiconductor is only one part of the design. Higher voltage, frequency and power density also increase the demands on electronic packaging materials such as die attach, substrates, top-side interconnects and module attach. (Source: Generated by AI)")
:quality(80)/p7i.vogel.de/wcms/5d/fb/5dfba5e5f38daf2b8597b05656af29c0/0133956337v2.jpeg "Wolfspeed has received a conditional commitment for a loan of up to $1.5 billion from the U.S. Department of War to support its domestic wide-bandgap semiconductor supply chain. (Source: © AspctStyle - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/bf/b6/bfb6ac295759be32d567df9849b6767e/0134094495v2.jpeg "Fraunhofer ISE reports that 25 Ah pouch cells with silicon-rich anodes retained more than 83% of their initial capacity after 1,000 cycles when tested under 1,000 kPa axial pressure. (Bild: Fraunhofer ISE)")
:quality(80)/p7i.vogel.de/wcms/16/dc/16dca55e6ef80e6b5da68bc628da2dcc/0133844782v2.jpeg "This article explains virtual power plants in modern renewable-heavy grids. (Source: © M@rketVisualsStudio - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/e8/33/e8330aae4bea3578b98ec2c1403d367a/0133980001v2.jpeg "IRENA’s 2026 World Energy Transition Outlook identifies faster electrification powered by renewables as central to meeting future global energy needs. (Source: Irena)")
:quality(80)/p7i.vogel.de/wcms/6c/b4/6cb405f47d25035e256ae90fe3a66ee6/0134032112v2.jpeg "Sungrow’s PowerTitan 3.0 energy storage platform uses onsemi EliteSiC hybrid power modules, with the companies reporting peak inverter efficiency above 99.3%. (Bild: onsemi)")
:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/af/7f/af7f7b0fb7f29219fc991b1130f65477/0132241333v2.jpeg "Comprehensive laboratory testing regimens—combining thermal cycling, high‑current stress, EMC, and accelerated lifetime tests—are essential to validate advanced power designs and ensure reliability in real‑world applications. (Source: PRBX)")
:quality(80)/p7i.vogel.de/wcms/16/3d/163df69363f8125315a9826e13ea4b05/0131927425v2.jpeg "Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure. (Source: Cadence)")
:quality(80)/p7i.vogel.de/wcms/85/b7/85b7e90733a2bd8f21515d8f7137f2fc/0131917677v2.jpeg "Renesas acquires Pictorus to integrate its embedded application software platform with Renesas’ MCU and MPU portfolio, helping developers shorten time‑to‑market and simplify system integration. (Source: © lucadp - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/f8/34/f834240d434a0c265a2ccafe614c8cd7/0134032109v4.jpeg "Hard- and soft-switching techniques shape voltage and current during device transitions, influencing switching losses, EMI and thermal performance in power converters. (Bild: © Mrthullab - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/27/07/2707280c807689b437baed3660257404/0133626052v2.jpeg "The quantum behavior of electrons shapes semiconductor devices—and the power converters that deliver electricity to modern computing systems. (Source: © Celt Studio - stock.adobe.com)")
/thumbor.vogel.de/44IcBp5M8pCWH1UlK9mvMGI5eMI=/1200x0/filters:format(png):upscale(1)/p7i.vogel.de/companies/67/58/675809616a4fb/header.jpeg)
:quality(80)/p7i.vogel.de/wcms/8c/8a/8c8aaaf3ac040ecf3da0e86d522eec0e/97038578.jpeg?v= "This is a SEM image of gallium nitride MMICs. (Source: University of Bristol)")
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:quality(80)/images.vogel.de/vogelonline/bdb/1839400/1839402/original.jpg?v= "Fully connected, controlled by artificial intelligence. Chancellor Merkel: „The new Bosch wafer fab will boost our capacity in microelectronics.“ (Bosch)")
Article | Jun 8, 2021
Bosch opens wafer fab of the future in Dresden
:quality(80)/images.vogel.de/vogelonline/bdb/1839300/1839318/original.jpg?v= "Mesago operates internationally and is not tied to a specific venue. With 160 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. (Mesago Messe Frankfurt GmbH)")
Article | Jun 8, 2021
All conference and forum presentations available on demand
:quality(80)/images.vogel.de/vogelonline/bdb/1838900/1838925/original.jpg?v= "The dynamic wireless charging test bed at ORNL accelerates an innovation that will charge electric vehicles while they’re being driven along specially equipped roadways. (Carlos Jones, ORNL/U.S. Dept. of Energy)")
Article | Jun 8, 2021
Hands-free: Wireless charging system advances electric vehicle convenience
:quality(80)/images.vogel.de/vogelonline/bdb/1838400/1838402/original.jpg?v= "(gemeinfrei)")
Article | Jun 7, 2021
Monocrystalline silicon solar cell reaches new high efficiency of 25.25 %
:quality(80)/p7i.vogel.de/wcms/87/1a/871a6253a7d92c11c054f3191bea847f/96987757.jpeg?v= "Modern charging circuits have diverse power supply challenges especially for 5G smartphones and wearables. (Source: Public Domain)")
Article | Jun 7, 2021
Charging solutions for electronic devices
:quality(80)/images.vogel.de/vogelonline/bdb/1832500/1832508/original.jpg?v= "The 1200 V devices are suitable for high-power density applications. (Infineon)")
Article | May 20, 2021
Infineon presents new EasyDUAL CoolSiC MOSFET power modules with high-performance ceramic
:quality(80)/p7i.vogel.de/wcms/d1/0e/d10e0c4bd41090bb8393c0ab7f9865aa/96560558.jpeg?v= "At PCIM Digital Days 2021, Seddik Bacha, Scientific Director and Scientific Committee Chair of the Supergrid Architecture & Systems research program at the SuperGrid Institute, presented a keynote titled \"HVDC grid challenges and opportunities\". (Bild: ©alexkich - stock.adobe.com)")
Article | May 17, 2021
PCIM 2021: HVDC grid challenges and opportunities
:quality(80)/p7i.vogel.de/wcms/8f/75/8f755a97db165f73ab46cf855f7376d6/96560561.jpeg?v= "At PCIM Digital Days 2021 on May 5, Hannes Stahr, Technology Manager at AT&S, presented a keynote titled \"Next Generation of Power Electronics Module Packaging\". (Source: ©Right 3 - stock.adobe.com)")
Article | May 12, 2021
PCIM 2021: Next generation of power electronics module packaging
:quality(80)/p7i.vogel.de/wcms/d5/2e/d52e3432b88fc5595cf6fcb4e6c4724e/96467972.jpeg?v= "At PCIM Digital Days 2021, Professor Johann Kolar of ETH Zurich presented a keynote titled \"Next-Generation SiC/GaN Three-Phase Variable-Speed Driver Inverter Concepts\". (Source: chainfoto24)")