MacDermid Alpha addresses power module reliability challenges at PCIM Europe 2026

PCIM 2026 MacDermid Alpha addresses power module reliability challenges at PCIM Europe 2026

2026-06-02 From MacDermid Alpha 1 min Reading Time

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MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460. The company will demonstrate how its latest attach materials help power electronics manufacturers improve reliability, improve process variation, and scale production more effectively.

Advanced die‑attach and solder preform solutions from MacDermid Alpha enable more repeatable manufacturing and higher reliability for automotive, industrial and AI data‑center power modules.(Source: MacDermid Alpha) — Advanced die‑attach and solder preform solutions from MacDermid Alpha enable more repeatable manufacturing and higher reliability for automotive, industrial and AI data‑center power modules.
(Source: MacDermid Alpha)

As automotive, industrial, and AI-driven data center applications demand higher power density and faster-switching devices, manufacturers are facing tighter thermal limits and increasing pressure to maintain stable, repeatable production. Bond line control, void reduction, and manufacturing consistency are becoming more critical to long-term power module performance. At PCIM Europe 2026, MacDermid Alpha will highlight its expanded ALPHA Argomax sintering portfolio and ALPHA TrueHeight solder preforms, designed to help customers improve thermal and electrical performance while supporting more stable, high-volume manufacturing.

MacDermid Alpha will also contribute to the PCIM Europe technical program, sharing insights on electronics assembly solutions for emerging applications. On the AI stage, John Hynek, Global Product Manager, will examine how attach materials can support the uptime and reliability demands of AI and data center infrastructure. In addition, Andreas Socarras, Senior Application Engineer, will present a poster session titled “Investigation of Large Area Soldering Using High Stress Assembly and Challenging Surface Coatings” as part of the PCIM Conference.

“Power electronics manufacturers need attach solutions that can deliver tighter process control and higher reliability without adding unnecessary complexity,” said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions. “At PCIM, we will show how our latest materials can help customers improve manufacturing stability and support the next generation of power module designs.”

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