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Heraeus Electronics GmbH & Co. KG

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Jun 30, 2026

Die Top System (DTS®) vs. Clip: Building Longer Lifetime into Future Power Modules

In close cooperation with Kiel University of Applied Sciences (HAW Kiel), we compared soldered clip solutions vs. Heraeus Electronics´ Die Top System (DTS®). While electrical and thermal performance are similar, the key differentiator is reliability: DTS® delivers significantly longer lifetime by better handling thermo-mechanical stress during power cycling.

The study provides a solid basis for evaluating the reliability and current carrying capability of DTS® compared with soldered clip solutions. However, a direct comparison between sintered clip designs and DTS® with Cu wire interconnection has not yet been investigated.

To address this gap, a joint project with ECPE (European Center for Power Electronics), led by HAW Kiel, has been initiated. The project will compare sintered and lead-soldered clip concepts with DTS® while also investigating the influence of clip designs and thickness on current capability, thermo-mechanical stress and power cycling reliability.

As power density and operating temperatures continue to increase, interconnection reliability will remain a key factor for achieving longer module lifetime and more robust power electronics.

Check it out here: Heraeus Electronics Die Top System (DTS®) vs. Clip