After three years of intensive collaboration, the European ICOS project has presented its final recommendations for strengthening the semiconductor industry in Europe. The report shows how international cooperation, targeted technological priorities and strategic partnerships can help translate Europe's research strength into industrial leadership and sustainably strengthen its role in the global semiconductor value chain.
Fraunhofer EMFT presents strategic recommendations to strengthen Europe’s semiconductor ecosystem and technological sovereignty.
(Source: Fraunhofer EMFT)
After three years, the ICOS (International Cooperation on Semiconductors) project has concluded its mission to strengthen Europe’s role in the global semiconductor value chain. Aligned with the EU Chips Act, the Green Deal, and the Digital Agenda, ICOS supported the European Commission in building strategic partnerships with leading semiconductor countries, including Japan, South Korea, India, Singapore, the United States, and Taiwan.
Key achievements include in-depth analyses of semiconductor ecosystems in Europe and major global players, a strategic gap analysis identifying cooperation opportunities, 24 international workshops, and concrete policy recommendations for research collaboration and standardization.
Overall, during its three years of operation, ICOS has implemented, strengthened and developed partnerships with the leading semiconductor countries, in close cooperation with the European Commission. Fraunhofer was participating in the project with its two institutes Fraunhofer EMFT and the Fraunhofer Institute for Integrated Systems and Device Technology IISB.
Technological Priorities for emerging technologies
ICOS highlights that international cooperation is now a strategic necessity to turn Europe’s strong research base into industrial leadership. Priority areas include AI and advanced computation (heterogeneous architectures, advanced packaging, memory solutions), quantum technologies, advanced functionalities (e.g., sensors, photonics, power electronics), and especially advanced packaging as a critical enabler.
The project concludes that cooperation must focus on complementary strengths—particularly in advanced packaging, high-volume integration, memory technologies, and AI-enabled design—while Europe simultaneously reinforces its internal capabilities through pilot lines, design infrastructure, and skills development.
Building on these results, the follow-up project ICOS-Squared will further advance Europe’s position in the global semiconductor ecosystem.
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