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ahead of its market launch. (Bild: Rohde & Schwarz)")
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:quality(80)/p7i.vogel.de/wcms/58/88/58889fb96ca264255299aaac8a5f57f3/0134281805v2.jpeg "Pacific Power Source Europe’s IPR Powerblocks combine multiple 37U racks to create configurable AC and AC/DC test systems that scale beyond 1 MVA. (Source: Caltest Instruments GmbH)")
:quality(80)/p7i.vogel.de/wcms/34/2a/342abdf41acfff908511b99bdba48643/0134318012v2.jpeg "Greenconn will present board-to-board, wire-to-board and waterproof automotive connector solutions at electronica 2026 in Munich. (Source: Greenconn)")
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:quality(80)/p7i.vogel.de/wcms/45/42/45427f08c9777c112b2d4ebfa43cad1f/0134236972v2.jpeg "Keren Bergman of Columbia University and Tomás Palacios of MIT have received the 2026 SIA/SRC University Research Awards, recognizing contributions to semiconductor design and technology. (Bild: © MonkeyART - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/c4/28/c42847e7f411b8bbc7e14cc5140af747/0134180875v2.jpeg "Infineon plans to invest around €1.1 billion in a high-volume 300 mm GaN manufacturing facility at its Villach site, with production scheduled to begin by the end of 2027. (Bild: Infineon)")
:quality(80)/p7i.vogel.de/wcms/d1/c9/d1c908f7f4c88ab54158b4e8e3a7b4ec/0134319340v2.jpeg "Integrated in BMW's \"Neue Klasse\", ROHM's silicon carbide chips support the advancement of next-generation electric mobility. (Bild: Copyright BMW AG)")
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:quality(80)/p7i.vogel.de/wcms/4f/0f/4f0fa2b721e1bbae869fac416a64a904/0134267327v2.jpeg "The BFOM metric is named after Indian engineer Jayant Baliga, who postulated it in 1979, a year before inventing the legendary power semiconductor IGBT. (Source: © Felippe Lopes - stock.adobe.com)")
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:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
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:fill(fff,0)/p7i.vogel.de/companies/6a/d1/6ad1e74c74462/22lpr.jpeg "22lpr ()")
Nov 6, 2026
Let's talk ceramics: CeramTec @ SEMICON EUROPA
From 10 to 13 November 2026, the European semiconductor industry will gather at SEMICON Europa in Munich – co-located with electronica and held under the theme "Europe's Next Era: Navigating the Perfect Storm". CeramTec shows how advanced ceramic solutions contribute to a competitive and resilient European semiconductor ecosystem.
At SEMICON Europa 2026, CeramTec presents its portfolio of advanced ceramics for semiconductor manufacturing. The show is regarded as the leading European platform connecting industry leaders across the entire design and manufacturing supply chain of the semiconductor industry. At the heart of CeramTec's presence are ceramic components for wafer handling, process chambers, metrology, thermal management and electrical insulation.
Come and visit us in hall C2, booth 335 and experience. Our on-site ceramics experts, including our 3D printing solutions team, look forward to discussing your individual application requirements with you.
Are you interested in a free visitor voucher? Then please write to us at cerainfo@ceramtec.de
Further information, your contact persons and downloads can be found here: CeramTec at SEMICON EUROPA 2026 in Munich
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