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SEMICONDUCTOR TECHNOLOGY
World’s first 300-millimeter power silicon carbide (SiC) wafer by Infineon
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HexaTech releases 100 mm diameter AIN substrate product
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Rohde & Schwarz presents a new generation of DC power supplies with five interconnectable channels
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Infineon launches MOSFETs to improve efficiency and power density in AI server
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Professors from Columbia University and MIT to be honored for excellence in semiconductor research
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Infineon to establish the world’s first high-volume manufacturing facility for GaN power semiconductors
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ROHM's Silicon Carbide contributes to the “Neue Klasse” Electric Powertrain Architecture of BMW
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What is power factor? Basics, formula, and calculation explanation
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Baliga figure of merit for wide-bandgap semiconductors
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GaN Reliability: From test-to-fail testing to real-world lifetime prediction
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Hioki achieves tenfold advance in high-frequency power calibration
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Laboratory testing regimens for advanced power design
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Cadence accelerates digital twin–driven data center AI modernization with HPE
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Renesas acquires Pictorus to speed embedded software
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HIGH FREQUENCY POWER
Hard switching vs. soft switching in high-frequency power converters
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Quantum weirdness, real watts: The physics connecting electrons and power
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:quality(80)/p7i.vogel.de/wcms/90/79/9079852cbc97da9394f4934d87fd2e6c/0134436386v2.jpeg "300-millimeter SiC wafer: Compared to a 200 mm wafer, a 300 mm wafer offers 2.3 times more chips per wafer. (Source: Infineon Technologies AG)")
:quality(80)/p7i.vogel.de/wcms/a1/a4/a1a41da7867a8e1ff3651e9909c21950/0134375260v2.jpeg "HexaTech is developing low-defect-density 100 mm aluminum nitride substrates for high-voltage and high-frequency semiconductor devices. (Source: © ultramcu - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/f9/08/f908f3b73e831929426deb8f04a63387/0134317000v2.jpeg "Rohde & Schwarz showcases the R&S HMP5050 5-channel power supply at electronica 2026
ahead of its market launch. (Bild: Rohde & Schwarz)")
:quality(80)/p7i.vogel.de/wcms/25/dc/25dc91e67728b665da06f02aae4d74c1/0134326821v2.jpeg "Infineon’s OptiMOS 7 40 V MOSFETs target high-frequency DC-DC conversion in AI servers, data centers and telecom infrastructure, including secondary-side stages in 800 V and 48 V power architectures. (Bild: Infineon)")
:quality(80)/p7i.vogel.de/wcms/34/2a/342abdf41acfff908511b99bdba48643/0134318012v2.jpeg "Greenconn will present board-to-board, wire-to-board and waterproof automotive connector solutions at electronica 2026 in Munich. (Source: Greenconn)")
:quality(80)/p7i.vogel.de/wcms/09/7a/097a613ffe6ecd5b2c1bca352dccacdc/0134265121v2.jpeg "LG Energy Solution and Energix have signed a non-binding MoU to explore supplying around 2 GWh of BESS solutions across Europe and the U.S. over the next 24 months, with discussions to expand the potential volume to 4.5 GWh. (Source: © Harley Kingston - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/45/42/45427f08c9777c112b2d4ebfa43cad1f/0134236972v2.jpeg "Keren Bergman of Columbia University and Tomás Palacios of MIT have received the 2026 SIA/SRC University Research Awards, recognizing contributions to semiconductor design and technology. (Bild: © MonkeyART - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/c4/28/c42847e7f411b8bbc7e14cc5140af747/0134180875v2.jpeg "Infineon plans to invest around €1.1 billion in a high-volume 300 mm GaN manufacturing facility at its Villach site, with production scheduled to begin by the end of 2027. (Bild: Infineon)")
:quality(80)/p7i.vogel.de/wcms/d1/c9/d1c908f7f4c88ab54158b4e8e3a7b4ec/0134319340v2.jpeg "Integrated in BMW's \"Neue Klasse\", ROHM's silicon carbide chips support the advancement of next-generation electric mobility. (Bild: Copyright BMW AG)")
:quality(80)/p7i.vogel.de/wcms/fb/2a/fb2a211434cb28cd144d94a4f1e2d170/0134316659v2.jpeg "This article explains what is power factor, different types of AC power, the power triangle, what is the power factor of a resistive load, leading and lagging power factors, the power factor formula, good power factors, and commercial performance in detail. (Bild: © Suranto - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/4f/0f/4f0fa2b721e1bbae869fac416a64a904/0134267327v2.jpeg "The BFOM metric is named after Indian engineer Jayant Baliga, who postulated it in 1979, a year before inventing the legendary power semiconductor IGBT. (Source: © Felippe Lopes - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/62/9f/629f4d10c9895a10aab2dd87a76931e4/0134234763v2.jpeg "Accelerated stress testing and failure analysis help identify GaN device degradation mechanisms and translate test data into application-specific lifetime estimates. (Bild: © danter - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/af/7f/af7f7b0fb7f29219fc991b1130f65477/0132241333v2.jpeg "Comprehensive laboratory testing regimens—combining thermal cycling, high‑current stress, EMC, and accelerated lifetime tests—are essential to validate advanced power designs and ensure reliability in real‑world applications. (Source: PRBX)")
:quality(80)/p7i.vogel.de/wcms/16/3d/163df69363f8125315a9826e13ea4b05/0131927425v2.jpeg "Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure. (Source: Cadence)")
:quality(80)/p7i.vogel.de/wcms/85/b7/85b7e90733a2bd8f21515d8f7137f2fc/0131917677v2.jpeg "Renesas acquires Pictorus to integrate its embedded application software platform with Renesas’ MCU and MPU portfolio, helping developers shorten time‑to‑market and simplify system integration. (Source: © lucadp - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/f8/34/f834240d434a0c265a2ccafe614c8cd7/0134032109v4.jpeg "Hard- and soft-switching techniques shape voltage and current during device transitions, influencing switching losses, EMI and thermal performance in power converters. (Bild: © Mrthullab - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/27/07/2707280c807689b437baed3660257404/0133626052v2.jpeg "The quantum behavior of electrons shapes semiconductor devices—and the power converters that deliver electricity to modern computing systems. (Source: © Celt Studio - stock.adobe.com)")
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