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AI SERVER POWER SUPPLIES
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
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Infineon ships new 40V CoolGaN BDS devices
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MATERIAL SCIENCE
Henkel's ultra-low viscosity Technomelt material delivers rugged protection for challenging electronic device designs
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RECOM unlocks discrete power design
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AUTOMOTIVE ENGINEERING EXPOSITION 2026 NAGOYA
Greenconn expands high-speed and automotive connector portfolio for the European market
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PCIM 2026
Power Management solutions covering the entire data-center architecture
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MacDermid Alpha addresses power module reliability challenges at PCIM Europe 2026
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PCIM executive circle: New high-level forum for strategic dialogue in power electronics
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The battle for every nano-watt: Challenges in designing ultra-low-power converters
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CATL launches world’s largest energy storage testbed
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Cadence unveils industry’s first fully autonomous virtual engineer for chip design
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Multiport power converters: All-in-one solution
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MEASUREMENT TOOLS
Hioki introduces new power measurement solutions
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Keysight introduces Infiniium XR8 oscilloscopes for faster high-speed validation
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New 44 ghz spectrum analyzer enables real-time signal analysis
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Siemens advances electrical design in industry with new software
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:quality(80)/p7i.vogel.de/wcms/6c/98/6c9836d116a84227aba27476f0b49690/0131639213v2.jpeg "Looking ahead to continued growth in the AI server and data center markets, ROHM will further strengthen the development and supply of power devices using SiC, GaN, and silicon. (Source: © mevideo - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/c9/40/c9401b5282d804eb594abe43c751e379/0131578069v2.jpeg "New CoolGaN BDS devices integrate back‑to‑back switching in a single package, delivering low gate charge, ultra‑low leakage and improved efficiency for fast‑charging mobile power systems. (symbolic image) (Source: © Kitta Studio - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/a9/d6/a9d6e9ecba5fb1d308838c5aa148ac37/0131508698v2.jpeg "With Technomelt PA 6370 Henkel has launched a new low pressure molding hot melt for challenging electronic device designs. (Source: Henkel AG & Co. KGaA)")
:quality(80)/p7i.vogel.de/wcms/94/f9/94f91ca8bec67fda930cb382dec83ec6/0131465746v2.jpeg "RECOM unveils discrete isolated DC/DC building blocks — SMD transformers, RVP driver ICs and RVS rectifiers — enabling modular, reflow‑compatible power designs for flyback, push‑pull and full‑bridge topologies (Source: RECOM)")
:quality(80)/p7i.vogel.de/wcms/b5/58/b55874104bf128af36ab420983a1a74f/0131625728v2.jpeg "GC01 (0.5 mm pitch) delivers floating, tolerance‑compensating board‑to‑board performance for high‑speed applications; GB05 provides secure wire‑to‑board connections for automotive and industrial systems. (Source: © WrightStudio - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/e3/a2/e3a2c363179aa46339ba27d0a1785217/0131622335v2.jpeg "At PCIM 2026 Mersen presents new electrical protection solutions for data centers. (Source: © nerminmuminovic - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/df/de/dfde53ac2f23feddfb142593b89981ed/0131617862v2.jpeg "Advanced die‑attach and solder preform solutions from MacDermid Alpha enable more repeatable manufacturing and higher reliability for automotive, industrial and AI data‑center power modules. (Source: MacDermid Alpha)")
:quality(80)/p7i.vogel.de/wcms/eb/0c/eb0c8cf409c67fd4fc2d73b7c507a015/0131581571v2.jpeg "The PCIM Executive Circle brings together selected industry leaders for strategic dialogue on market trends, technological challenges and the future of power electronics. (Source: PCIM)")
:quality(80)/p7i.vogel.de/wcms/3f/77/3f77be835f67d66c9c7bbf179577577a/0131631955v2.jpeg "Inspector examination of photovoltaic modules using a thermal imaging camera (Source: © kanpisut - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/84/1f/841f6921da6203c30dac2963c7a0df81/0131601493v2.jpeg "New multi‑chemistry systems from CATL target fast charging, higher energy density and lightweight flexible applications, with sodium‑ion mass‑production plans announced for 2026. (Source: CATL)")
:quality(80)/p7i.vogel.de/wcms/4f/85/4f85b50e15a85d90bb71ce34ab5aede6/0131600916v2.jpeg "Cadence unveils a fully autonomous virtual engineer for chip design—an AI super agent that autonomously runs design and verification workflows, accelerating complex semiconductor development. (symbolic image) (Source: © Dece Std - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/84/8c/848c7bba38a1285b0dfa2510988d631d/0131577029v2.jpeg "This article talks about multiport power converters. (Source: © Moviebirth - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/34/4a/344a3dc5a19429cf6726b7f8f7e2ee32/0130109719v2.jpeg "Hioki’s new measurement solutions enable precise analysis of power electronics systems and energy efficiency. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/be/c8/bec8d43fc0ee73414274be44608b2970/0129748903v2.jpeg "The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)")
:quality(80)/p7i.vogel.de/wcms/23/ee/23ee4a97790d6009dbfd7d9577ffa723/0129220424v2.jpeg "The R&S FPL1044 with the new RTSA option makes 40 MHz real-time frequency analysis available up to 44 GHz. (Source: Rohde & Schwarz )")
:quality(80)/p7i.vogel.de/wcms/3c/d1/3cd1cacbceb792ba63727199c61ca434/0127801860v2.jpeg "Thanks to cloud technology, users can collaborate on projects from anywhere and always have access to the latest planning data. (Source: SIEMENS)")
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