AI POWER Wolfspeed and LITEON partner to support hyperscale AI data center deployments

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Wolfspeed, Inc.have announced a strategic partnership and the successful qualification of Wolfspeed's silicon carbide technology for deployment within LITEON's 800VDC power sidecar and compute rack PSU platforms. These platforms are designed to support next-generation AI data centers for leading hyperscale customers, with the potential for broader adoption across multiple cloud service provider (CSP) platforms and future deployments.

AI-driven growth is accelerating the industry's transition to 800 VDC power architectures as data centers prioritize energy efficiency, power density, scalability, and total cost of ownership in critical applications such as power supply units (PSUs) and battery backup units (BBUs). Wolfspeed's family of silicon carbide MOSFETs enables more efficient power delivery across a wide range of operating conditions, helping power system designers maximize efficiency while reducing bill of materials (BOM) costs and simplifying procurement.

LITEON is collaborating with Wolfspeed to leverage silicon carbide technology and its 200mm silicon carbide manufacturing platform, in support of hyperscale AI infrastructure deployments. The partnership reflects both companies' commitment to delivering highly reliable 800 VDC power solutions that can be rapidly deployed at scale while meeting the demanding performance and durability requirements of next-generation AI data centers.

DATA CENTERS

12V to 48V to 400V to 800V evolution of data center power distribution

"Our partnership with LITEON demonstrates Wolfspeed's commitment to enabling the rapidly growing AI data center market through advanced silicon carbide technology and a robust, scalable supply chain," said Robert Feurle, Chief Executive Officer of Wolfspeed. "As hyperscale customers accelerate investments in AI infrastructure, Wolfspeed is uniquely positioned to support the industry's transition to higher-efficiency power architectures."

"Integrating Wolfspeed's silicon carbide technology into our 800V VDC power architecture strengthens LITEON's ability to meet the performance, efficiency, and reliability requirements of next-generation AI infrastructure," said John Chang, General Manager, Cloud Infrastructure Platform & Solution SBG, LITEON Technology. " As demand for AI infrastructure continues to accelerate, this collaboration strengthens our ability to support next-generation data center platforms."

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