SEMICONDUCTOR PACKAGES
Resonac unveils high-tech laminates for future semiconductor packages
DIODES
New high speed optimized flip-chip package technology for automotive ESD protection
SEMICONDUCTORS
Vishay Intertechnology Releases AEC-Q100 Qualified RGBIR Color Sensor in Compact 2.67 mm x 2.45 mm x 0.6 mm Package
INDUCTORS
Bourns launches high-frequency AEC-Q200 compliant automotive chip inductors
LITHIUM-ION BATTERIES
Double the efficiency: Toshiba's latest SCiB module transforms heat dissipation in EV batteries
GALLIUM NITRIDE
Imec identifies stable operating range for GaN MISHEMTs in RF power amplifiers
TRANSITORS
Mitsubishi Electric to ship samples of XB series HVIGBT module
MOSFET TECHNOLOGY
Vishay Intertechnology Gen 4.5 650 V E Series Power MOSFET Delivers Industry’s Lowest RDS(ON)*Qg and RDS(ON)*Co(er) FOMs
Galleries
MOSFET
AOS introduces advanced MOSFET packages for high-current efficiency
ISOLATED MODULATORS
TI introduces new line of functionally isolated modulators
MODULATOR
High current sensing with new ACPL-736J ±50mV External Clock Sigma Delta Modulator
SJ MOSFETS
Magnachip expands product range with 25 advanced 6th-Gen SJ MOSFETs