Mitsubishi Electric Corporation has announced that it will launch a free service on June 28 to provide design and validation data on a proprietary prototype inverter used for power conversion systems (PCSs). The Mitsubishi Electric’s prototype inverter incorporates the company’s insulated gate bipolar transistor (IGBT) module embedded with the latest 8th-generation IGBTs. The service is expected to help customers accelerate their development of PCSs for solar power and other renewable energy applications.
Mitsubishi Electric begins shipping 5th‑generation SiC MOSFET bare‑die samples, delivering lower on‑resistance and improved efficiency for high‑density power converters in automotive and industrial applications. (symbolic image)
The service will provide design and validation data for three-level inverters,1 including experimental results obtained through a technical collaboration with the Industrial Technology Research Institute (ITRI) in Taiwan.
Mitsubishi Electric aims to reduce user workloads in parts selection, design, manufacturing and validation by providing comprehensive data on its Industrial LV100-type 1.2kV IGBT Module (for large-capacity PCSs) and the Industrial NX-type 1.2kV IGBT Module (for medium- to large-capacity PCSs). This is expected to contribute to the faster development of renewable energy inverters.
The global expansion of renewable energy power generation has increased demand for PCSs that convert power between direct current (DC) and alternating current (AC). Megawatt-class, high-voltage and large-capacity PCSs used in large-scale installations, such as mega-solar plants, require three-level inverter topologies to achieve high efficiency and compact size. However, incorporating power semiconductors into such systems poses challenges, including complex thermal design, fault protection, high-density layout design, and time-consuming validation at the system level.
To address these challenges, Mitsubishi Electric will provide data on prototype inverters equipped with its IGBT modules, including LV100 and NX types, which are both embedded with the latest 8th-generation IGBTs. The service will lighten development burdens and shorten the time to market for customers by offering design data, such as geometry, component layout and electrical circuitry, as well as validation data from real-world evaluations of thermal characteristics and short-circuit protection. Obtaining such data is often a technical hurdle in developing medium-to-large capacity systems.
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