Higher power densities, SiC and GaN devices, and increasingly compact packaging make surface quality a critical production factor. Even minor contamination or oxide layers can destabilize bonding, contacting, sintering, underfilling, molding and cause delamination. This white paper explains how atmospheric and low-pressure plasma processes help manufacturers achieve reproducible surface conditions for demanding power electronics applications. It demonstrates how oxide layers can be reduced without leaving residue and how surfaces can be cleaned and activated in a controlled manner. The technologies can be integrated into automated production environments or deployed as standalone process solutions.

In this whitepaper you will learn more about:

• Why surface quality determines the reliability of bonding, contacting, sintering, underfilling and molding 
• Where chemical cleaning and flux-based processes reach their limits in compact assemblies 
• How to use atmospheric or low-pressure plasma for materials, geometry and production conditions 
• How residue-free inline oxide reduction can reduce process steps and interference risks 
• How validation, monitoring and traceability support reproducible series production