AI INFRASTRUCTURE GlobalFoundries advances co‑packaged optics for AI data centers

GlobalFoundries has announced the introduction of its SCAL optical module solution for co-packaged optics (CPO). GF’s SCALE solution, or Silicon photonics Co-packaged Advanced Light Engine solution, is the industry’s first Optical Compute Interconnect Multi-Source Agreement (OCI MSA) capable platform, exceeding the requirements for the OCI MSA’s optical interconnect specification for modern AI scale-up architectures.

Built with GF’s advanced silicon photonics technology, the SCALE CPO solution utilizes both coarse and dense wavelength-division multiplexing (CWDM, DWDM) for bi-directional data transmission over each optical fiber for significant improvements in bandwidth density and system scalability versus traditional copper interconnects. GF has already demonstrated 8λ and 16λ bi-directional DWDM natively on its platform, a fundamental technology milestone that uniquely positions GF to support the industry’s shift to CPO and accelerate the adoption of optical scale-up interconnects.

GF’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes. Additional features include through silicon vias (TSVs) for high-speed signaling and power delivery and copper pad pitches ranging from 110μm down to sub‑45μm for 2.5D/3D stacking from organic substrates to silicon interposers, enabling customers to move quickly from design to volume production.

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The platform integrates electrical ICs on single-digit advanced nodes, enabling optimization between best-in-class compute and state-of-the-art optics without compromising performance. While GF offers multiple fiber-attach approaches, the SCALE solution leverages broadband detachable fibers with flat insertion loss over the CWDM spectrum to future-proof scaling from 4λ in each direction to 8λ and beyond, while still enabling serviceability and known-good-die testability for next-generation AI interconnects.

“With over a decade of innovation and manufacturing expertise in silicon photonics technology at our disposal, GF stands ready to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics,” said Mike Hogan, chief business officer at GF. “Today, our technology already exceeds the requirements set by the OCI MSA, demonstrating our close collaboration with industry leaders and our technology’s readiness to scale next-generation, AI infrastructure.”

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