TDK Corporation introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms.

The silicon power MOSFET has been the most important device for changing low- and medium-voltage power for more than forty years. It was the best choice for everything from consumer electronics and telecom infrastructure to industrial power supplies and automotive systems because it was easy to use, had a well-established manufacturing ecosystem, and its performance was easy to predict.

Did you know that Faraday’s laws enable a magnetic source to induce a current in a nearby electronic device, without having any physical contact? Faraday’s laws can become a futuristic reason to say “goodbye, heavy wires”. This article describes Faraday’s two laws of electromagnetic induction and discusses their significance in the world of electronics.

Onsemi announced the commercialization of its new vertical gallium nitride technology. The company calls it a breakthrough for AI and electrification. But GaN has already been a champion in the power and RF industry; what’s so new about this?

The job of a gas station or tankstelle has always been refuelling vehicles and sending them back to the road. The energy flow of non-renewables is unidirectional. For electric vehicle charging, scientists and researchers reimagined charging stations. Manufacturers moved EV chargers beyond charging, turning vehicles into energy storage systems on wheels.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Wolfspeed, Inc. announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.

Are standard heat sinks just option B for cooling high-performance electronics? Not at all. CTX Thermal Solutions boasts a standard product range that provides the best fitting heat sinks for nearly all kinds of performance requirements. To the user, this means: the most suitable cooling with all economic and logistics benefits offered by standard production.

After three years of intensive collaboration, the European ICOS project has presented its final recommendations for strengthening the semiconductor industry in Europe. The report shows how international cooperation, targeted technological priorities and strategic partnerships can help translate Europe's research strength into industrial leadership and sustainably strengthen its role in the global semiconductor value chain.

Empower Semiconductor announced the launch of three new embedded silicon capacitors (ECAPs), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors.