ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL packages. Compared to conventional packages with equivalent voltage ratings and on-resistance, these packages offer improved thermal performance. This enables high-power handling despite their compact size and low profile. Intended for industrial equipment, including server PSUs and energy storage systems, that require low‑profile components to meet higher power‑density and form‑factor objectives.
ROHM’s SiC MOSFETs in a low‑profile TOLL package support higher‑density power supplies for servers and energy storage.
(Source: ROHM)
In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturization, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.
ROHM's new product addresses these needs by reducing component footprint by approximately 26% and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, ROHM's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.
The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025 (sample price: $37.0/unit, tax excluded). These products are available for online purchase from online distributors such as DigiKey, MOUSER and Farnell. Simulation models for all six new products are available on ROHM's official website, supporting rapid circuit design evaluation.
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