Power Integrations has introduced a breakthrough in flyback topology extending the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies. The new TOPSwitchGaN flyback IC family unites the company’s groundbreaking PowiGaN technology with its iconic TOPSwitch IC architecture, reducing complexity, eliminating heat sinks in many cases, shortening design time, improving manufacturability, and lowering total system cost.

Efficient Power Conversion (EPC) has introduced the EPC91121 motor drive inverter evaluation board, built around the Gen-7 EPC2366 40 V eGaN power transistor. The EPC91121 is engineered for rapid prototyping of advanced motor drive architectures in applications such as drones, robotics, industrial automation, handheld power tools, and other compact electromechanical systems where high efficiency and power density are critical.

Efficient Power Conversion, a supplier of enhancement-mode gallium nitride power devices, announced the release of its Phase 18 Reliability Report, providing new insights into eGaN device reliability. The report builds on previous work by closing the gap between lab-generated reliability testing and real-world device performance across mission profiles.

Microchip Technology announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The BZPACK modules can deliver exceptional reliability, streamline manufacturing and offer versatile system‑integration options for the most demanding power‑conversion environments.

Analog Devices, Inc. announced the opening of its new advanced manufacturing facility in Thailand, further strengthening its advanced manufacturing and test capacity while expanding resilient, sustainable semiconductor production in the Asia-Pacific region. The expansion builds on ADI’s hybrid manufacturing strategy, which leverages a global network of internal factories and external foundry/Outsourced Semiconductor Assembly and Test (OSAT) partners to deliver resilient, high‑performance solutions.

From 9 to 11 June 2026, the leading international exhibition and conference for power electronics, the PCIM Expo & Conference, returns to Nuremberg, Germany. With over 650 exhibitors and a record-breaking 500+ presentations, this hub for the power electronics industry will offer a comprehensive program for trade visitors. With the new AI & Data Centers Stage, this year’s trade fair and conference program will focus on the topic of artificial intelligence and data centers for the first time.

Vicor Corporation announced that the BCM6135 DC-DC bidirectional power converter module won the 2026 Electronics Excellence Award in the power category sponsored by Electronic Specifier. The annual award celebrates the most innovative and impactful achievements across the electronics sector.

After three years of intensive collaboration, the European ICOS project has presented its final recommendations for strengthening the semiconductor industry in Europe. The report shows how international cooperation, targeted technological priorities and strategic partnerships can help translate Europe's research strength into industrial leadership and sustainably strengthen its role in the global semiconductor value chain.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This paper proposes a new gate driver that always achieves the fastest switching while keeping the surge voltage below the breakdown voltage.

ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiCTM brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE packTM" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.

The Solid State Transformer (SST) has been gaining tremendous attention, both in academia and industry, promising extraordinary (often hyped) power conversion performances, well beyond the current state of the art converters. Despite well-evidenced efforts, SST as a technology is still somewhat struggling to gain commercial traction and find its place on the market.

Menlo Microsystems, Inc., announced the successful completion of Task 4 of the U.S. Navy’s 10 MW Advanced Circuit Breaker Development Program, demonstrating Menlo’s position as a trusted partner for defense, industrial, and commercial applications, including AI data centers.

MIT engineers demonstrated a new type of magnetic transistor that performs the three-in-one action of current switching, amplification, and memory storage. The industry is continuously seeking silicon alternatives to enhance the operability and efficiency of end-products.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Keysight Technologies, launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family. The R&S FPL1044 is an industry first, delivering high-frequency performance up to 44 GHz at a price point previously unattainable in the market. The universal RTSA option empowers FPL users with powerful real-time analysis capabilities.

Siemens has expanded the TIA Selection Tool Cloud with the new “Electrical Designer” feature for electrical planning. This smart software is the first and only in the IEC market that includes basic electrical knowledge and standards expertise. Electrical Designer simplifies main circuit design by automatically selecting components, verifying short-circuits, sizing cables, and creating all necessary documentation.