Wolfspeed, Inc. announced the successful production of a single-crystal 300mm (12-inch) silicon carbide wafer, describing it as an industry milestone. The company cited its silicon carbide IP portfolio of more than 2,300 issued and pending patents worldwide and said the development supports its path toward future volume commercialization of 300mm technology.

Harbinger, an American automotive and industrial manufacturer, announced Harbinger Industria, a new business line offering Harbinger battery technology as standalone products for energy storage and auxiliary power. Airstream, the iconic manufacturer of handcrafted, riveted aluminum travel trailers, is the first customer to integrate Harbinger’s energy storage technology.

Mitsubishi Electric Corporation announced that, beginning January 21, it will start shipping samples of four new trenchsilicon carbide metal-oxide-semiconductor field-effect transistor (SiC-MOSFET) bare dies designed for use in power electronics equipment, such as electric vehicle (EV) traction inverters, onboard chargers, and power supply systems for renewable energy sources including solar power.

Exxelia has developed a new Smart Integrated Magnetics solution designed for advanced power conditioning and distribution units (PCDUs) operating in constrained and demanding environments such as space systems.

Greenconn announces two major milestones as it enters the new year: the company has been awarded the EcoVadis Bronze rating end of 2025 and has improved the performance of its 0.5 mm pitch floating connector series. Together, these achievements underline Greenconn’s commitment to sustainable growth and continuous technological innovation.

In 2025, the share of renewables in Germany’s net public electricity generation amounted to 55.9 percent, as in the previous year. Wind power took first place as the strongest net electricity producer, followed by photovoltaics, which increased its production by 21 percent in 2025 and overtook lignite for the first time.

MediaTek, an semiconductor company focused on developing a range of innovative solutions, has announced that it is working closely with DENSO, a automotive technology provider, to develop a custom automotive System-on-Chip (SoC) solution tailored for Advanced Driver-Assistance Systems (ADAS) and cockpit systems.

StoreDot, an Israeli company for battery technology for EVs and Andretti Acquisition Corp. II, a Cayman Islands special purpose acquisition company, have entered into a definitive agreement to combine their businesses under a newly formed holding company.The holding company will be named “XFC Battery” and its shares are expected to be listed for trading on the Nasdaq Stock Market LLC.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This paper proposes a new gate driver that always achieves the fastest switching while keeping the surge voltage below the breakdown voltage.

Syensqo and Axens announced the launch of Argylium, a new company dedicated to developing and scaling-up commercial demonstration of advanced materials for solid-state batteries in Europe. This collaboration represents an important step toward strengthening Europe’s innovation and excellence in creating the next generation of batteries.

National Laboratory of the Rockies Helps Kauai Tap Into a New Source of Strength That Can Stop Electric Oscillations. Kauai, one of the most remote islands of Hawaii, stands steady among the timeless crash of ocean waves. Electric waves, however, almost crashed Kauai’s power system in an instant.Kauai consistently provides among the lowest electricity rates of any island in Hawaii thanks to Kauai Island Utility Cooperative’s (KIUC’s) addition of new power sources, many of which rely on electronic devices called inverters.

Menlo Microsystems, Inc., announced a partnership with Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, that it has successfully completed the hot switching validation of a MEMS-based 1000V/500A (0.5 megawatt) relay panel that is the basis platform for future development of advanced circuit protection systems for the U.S. Navy.

Through its XbloX platform, analog/mixed-signal and specialty foundry X-FAB offers easy access to a standardized yet flexible set of SiC process technologies that accelerate the development of advanced power devices. From rapid prototyping to full production, the modular and fully scalable XbloX platform helps SiC device developers to expedite engineering assessments and technology release, with production starts achieved up to nine months faster than traditional methods.

Siemens has expanded the TIA Selection Tool Cloud with the new “Electrical Designer” feature for electrical planning. This smart software is the first and only in the IEC market that includes basic electrical knowledge and standards expertise. Electrical Designer simplifies main circuit design by automatically selecting components, verifying short-circuits, sizing cables, and creating all necessary documentation.

Siemens Digital Industries Software has announced the Cre8Ventures Open Higher Education Program, an ambitious new initiative developed in collaboration with Arm and the University of Southampton’s School of Electronics and Computer Science, to foster entrepreneurial curiosity and accelerate student-led semiconductor innovation across Europe’s leading technical universities.

Rolls-Royce is launching its new Battery Analytics software for its mtu EnergyPack battery solutions, providing real-time insights, predictive maintenance, and enhanced cybersecurity to maximize performance and service life.

Siemens Digital Industries Software has announce that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board design. This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business market.