The new TOPSwitchGaN flyback IC family extends the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies. (Source: Power Integrations)
POWER CONVERSION

Power Integrations extends flyback topology to 440 W

Power Integrations has introduced a breakthrough in flyback topology extending the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies. The new TOPSwitchGaN flyback IC family unites the company’s groundbreaking PowiGaN technology with its iconic TOPSwitch IC architecture, reducing complexity, eliminating heat sinks in many cases, shortening design time, improving manufacturability, and lowering total system cost.

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The new evaluation platform enables developers to explore the performance benefits of seventh-generation GaN technology in motor control systems. (Source: © danter - stock.adobe.com)
WIDE BANDGAP

EPC introduces GaN-based BLDC motor drive evaluation board

Efficient Power Conversion (EPC) has introduced the EPC91121 motor drive inverter evaluation board, built around the Gen-7 EPC2366 40 V eGaN power transistor. The EPC91121 is engineered for rapid prototyping of advanced motor drive architectures in applications such as drones, robotics, industrial automation, handheld power tools, and other compact electromechanical systems where high efficiency and power density are critical.

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The Humpback Creek hydroelectric facility in Cordova, Alaska, was the site of an edge data center pilot project.  (Source: Chelsea Haisman via NLR)
COMPUTE INFRASTRUCTURE

The grid can't keep up with AI; data centers are bringing their own power plants

A 170 kW edge data center located inside an Alaskan hydroelectric plant is a small example of a much larger shift toward self-powered compute infrastructure. The Cordova Electric Cooperative and San Francisco-based Greensparc have deployed a 170-kilowatt edge data center inside the Humpback Creek hydroelectric facility in Cordova, Alaska, co-locating GPU compute directly with surplus renewable generation on a U.S. Department of Energy-supported microgrid.

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Boron nitride has exceptional chemical and thermal properties. When voltage is applied to boron nitride, it emits light.  (Source: © kaliel - stock.adobe.com)
WIDE BANDGAP MATERIALS

Exploring insulating boron nitride as a semiconductor

The industry needs power semiconductor devices with higher power densities and electron mobilities. Both are achievable with the help of a wide band gap and various other properties. It makes so many compounds suitable to become the next standard in the industry. Silicon carbide (SiC) and gallium nitride (GaN) replaced silicon in many power applications.

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PCIM Expo & Conference 2026 brings together 650+ exhibitors and 500+ presentations on power electronics, SiC/GaN devices, and energy management. (Source: Mesago Messe Frankfurt GmbH / Arturo Rivas Gonzalez)
POWER INNOVATION

PCIM Expo & Conference 2026: Discover the future of power electronics

From 9 – 11 June 2026, Nuremberg will once again become the international hub for power electronics. The PCIM Expo & Conference brings together experts from around the world to discuss the latest developments and future trends in the industry. The event provides a comprehensive overview of the innovative products, solutions, and trends that will help shape the power electronics industry in the future. This year, for the first time, a new stage will shine a light on the topic of artificial intelligence and data centers.

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Global renewable energy capacity grew by nearly 700 GW in 2025, highlighting the continued momentum of the energy transition. (Source: Irena)
RENEWABLE ENERGY

Near-700 GW surge in 2025 proves renewable energy resilience

2025 saw total renewable power capacity reach 5149 gigawatts (GW) after the addition of 692 GW, or a 15.5% of annual increase, according to new report by the International Renewable Energy Agency (IRENA). The Renewable Capacity Statistics 2026 also finds renewable energy dominates the total capacity expansion at 85.6% share, while non-renewables continue to account for a smaller share of additions.

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Infineon's silicon carbide power semiconductors will enhance efficiency, power density and reliability of DG Matrix's solid-state transformer platform

 (Source: Infineon)
AUTOMOTIVE SEMICONDUCTORS

Infineon advances software-defined vehicle architecture

Infineon Technologies AG and DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC) technology from Infineon for use in its Interport multi-port solid-state transformer platform. This strengthens DG Matrix's semiconductor supply chain and enhances the efficiency, power density, and reliability of its SST systems, which are deployed worldwide.

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Bourns introduces high-current shielded power inductors designed for compact, high-density electronic applications. (Source: BOURNS)
POWER INDUCTOR

Bourns introduces high-current shielded power inductors

Bourns has announced the SRP2008DP Series, its new line of high current shielded power inductors designed for high current applications that need to push the limits of board-space efficiency. Constructed with a metal-alloy powder core and packaged in a low-profile 0.8 mm footprint, the SRP2008DP Series delivers the saturation current capacity that power dense DC-DC converter designs demand—without the design layout penalties that typically accompany such performance.

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