TDK Corporation has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features.

Vicor Corporation announced that the BCM6135 DC-DC bidirectional power converter module won the 2026 Electronics Excellence Award in the power category sponsored by Electronic Specifier. The annual award celebrates the most innovative and impactful achievements across the electronics sector.

From 9 to 11 June 2026, the leading international exhibition and conference for power electronics, the PCIM Expo & Conference, returns to Nuremberg, Germany. With over 650 exhibitors and a record-breaking 500+ presentations, this hub for the power electronics industry will offer a comprehensive program for trade visitors. With the new AI & Data Centers Stage, this year’s trade fair and conference program will focus on the topic of artificial intelligence and data centers for the first time.

Analog Devices, Inc. announced the opening of its new advanced manufacturing facility in Thailand, further strengthening its advanced manufacturing and test capacity while expanding resilient, sustainable semiconductor production in the Asia-Pacific region. The expansion builds on ADI’s hybrid manufacturing strategy, which leverages a global network of internal factories and external foundry/Outsourced Semiconductor Assembly and Test (OSAT) partners to deliver resilient, high‑performance solutions.

2D semiconductors are harder to produce compared to traditional silicon semiconductors. According to recent news from the SCMP - South China Morning Post, researchers have simplified the production of 2D semiconductors. The transistors built on the newly developed modular process exhibit a 10 times higher electron mobility.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, introduced the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar microinverters, AI data centers and onboard electric vehicle chargers.

A consortium of scientists from the Fraunhofer Institute for Solar Energy Systems ISE and Smart Battery Solutions GmbH succeeded in replacing the steel connectors used to interconnect battery cells with copper during resistance projection welding. In doing so, the team demonstrated something that had long been considered impossible in the battery industry: Until now, battery manufacturers looking to switch to more powerful, copper-interconnected batteries had to replace their projection welding systems with laser welding systems.

Efficient Power Conversion, a supplier of enhancement-mode gallium nitride power devices, announced the release of its Phase 18 Reliability Report, providing new insights into eGaN device reliability. The report builds on previous work by closing the gap between lab-generated reliability testing and real-world device performance across mission profiles.

Microchip Technology announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The BZPACK modules can deliver exceptional reliability, streamline manufacturing and offer versatile system‑integration options for the most demanding power‑conversion environments.

Toshiba Electronic Devices & Storage Corporation has launched a photovoltaic-output photocoupler, "TLX9920", in a thin, long-creepage-distance SO6L package, for solid state relays (SSR) in automotive equipment. Demand is growing for automotive equipment relay units with a longer life, a trend that has led to increased use of SSR instead of mechanical relays. As automotive systems continue to evolve, the shift to SSR is expected to accelerate further.