Semiconductor supply chains diverge in late 2025 as power and analog ICs normalize while AI-driven compute remains constrained. (Source: © piggu - stock.adobe.com)
SEMICONDUCTOR INDUSTRY NEWS

Q4 2025 semiconductor update: AI packaging delays, power component supply stabilizes

In Q4 2025, the semiconductor market split into two distinct realities. While analog and power IC supply largely normalized across industrial, automotive, and IoT segments, backend capacity and memory remained persistent bottlenecks. Surging AI compute demand continued to strain advanced packaging and DRAM supply, reinforcing structural constraints across the silicon value chain.

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On-orbit AI can detect temperature anomalies such as wildfires, volcanic activity, or industrial accidents with the Spacechips AI1 processer. This helps emergency management teams make faster, better-informed decisions about which fire prone areas are the most vulnerable.   (Source: Vicor)
SPACE POWER

Power breakthrough for in-orbit AI processing

Vicor, a high-density power solutions provider, has partnered with Spacechips, developer of space-electronics solutions for satellites and spacecraft, to design power-dense, reliable transponder for in-orbit AI processing. Spacechips’ AI1 transponder is radiation-tolerant, rugged and compact featuring Vicor’s high density power modules, setting a new standard for power processing, and enabling the next-generation of computing and application design for New Space.

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Symbolic image: A retrofitted EV charges wirelessly via the ground-embedded coil, with the charging process starting automatically once the vehicle is positioned correctly. (Source: © Johnnii - stock.adobe.com)
INDUCTIVE CHARCHING

Fast and easy charging of electric cars without cables

Automatic charging instead of plugging in cables: In a cooperative project, Empa researchers investigated inductive charging of electric cars. This is not only similarly efficient to cable-based charging, but could also simplify the integration of vehicle batteries as flexible storage devices into the electricity grid. The first cars in Switzerland to be converted for inductive charging have already been approved for road use.

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Collaboration and AI converge to reinforce global semiconductor manufacturing capacity. (Source: © VERTEX SPACE - stock.adobe.com)
STRATEGIC PARTNERSHIP

Collaboration accelerates AI-driven manufacturing for global semiconductor supply

Siemens and GlobalFoundries have entered a new strategic collaboration to leverage each company’s complementary AI-based capabilities to enhance performance of semiconductor manufacturing and advanced industries – making operations more efficient, secure and reliable. In their latest memorandum of understanding, the companies focus on automation technologies for semiconductor fabrication, electrification, digital solutions and software ranging from chip development to product lifecycle management.

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Top-cool package delivers superior thermal performance, reliability, and design flexibility for EVs, solar infrastructure, and energy storage systems. (Source: onsemi)
THERMAL EFFICIENCY

New cooling packaging technology to drive efficiency in applications

onsemi announced the release of its EliteSiC MOSFETs in the industry-standard T2PAK top-cool package, advancing power packaging for automotive and industrial applications. This new offering delivers thermal performance, reliability and design flexibility for demanding high-power, high-voltage applications for markets including electric vehicles, solar infrastructure, and energy storage systems.

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ROHM’s SiC MOSFETs in a low‑profile TOLL package support higher‑density power supplies for servers and energy storage. (Source: ROHM)
SiC MOSFETs

New SiC MOSFETs that achieves both miniaturization and high-power capability

ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL packages. Compared to conventional packages with equivalent voltage ratings and on-resistance, these packages offer improved thermal performance. This enables high-power handling despite their compact size and low profile. Intended for industrial equipment, including server PSUs and energy storage systems, that require low‑profile components to meet higher power‑density and form‑factor objectives.

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