Toshiba Electronic Devices & Storage Corporation has launched “TPH2R70AR5,” a 100V N-channel power MOSFET fabricated with U-MOS11-H, Toshiba’s latest-generation process1). The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in data centers and communications base stations.

On September 12, Greenconn concluded its participation at Nepcon Vietnam 2025, showcasing innovative connector solutions for industrial and automotive applications. The event reinforced the company’s engagement with partners and customers across Southeast Asia.

The circular economy in electronics focuses on minimizing waste and maximizing the use of materials. Using frameworks like the 10R hierarchy and 60R taxonomy, strategies promote extending product life and leveraging durable components such as semiconductors. The emphasis on “reuse at the highest level” supports longer use of entire devices, reducing new production needs. Future innovations like digital product passports and AI-driven maintenance are set to enhance sustainability in the sector.

The World Is Facing Rising Energy Demands. NREL’s ULIS Power Module May Be an Answer. Driven by innovative silicon-carbide-based technology, the Ultra-Low Inductance Smart power module offers unprecedented efficiency and power density, making it ideal for high-intensity applications like data centers, power grids, and advanced vehicles. With its compact design and cost-effective manufacturing, ULIS significantly enhances the conversion of electricity into usable power, providing a promising solution for modern energy challenges.

As the global electronics industry undergoes a seismic shift toward sustainability, efficiency, and sovereignty, Silicon Carbide (SiC) is emerging as the cornerstone of next-generation power electronics. At the heart of this transformation is FastLane—a three-year European funded project launched in 2024, uniting 29 partners across seven countries to redefine the SiC value chain from raw materials to system-level demonstrators.

This article introduces a holistic 7D approach to power module design, integrating electrical, thermal, mechanical, and manufacturing aspects to achieve efficiency, reliability, and cost-effectiveness.

The global power module market is entering a high-stakes transition. While silicon IGBTs still dominate in unit terms, wide-bandgap modules are driving growth, and the performance race is shifting from die to packaging.

This article describes the Peltier effect, how it is generated and how it can be used. The aim is for the reader to understand the thermoelectric phenomenon behind the heating of one surface and the cooling of another and the applications that have been developed taking advantage of these features. Without considering poor sealing aspects that reduce efficiency or attempting to have low thermal conductivity materials, this knowledge is intended for advanced and energy-saving applications where heating and cooling are present in a single system.

IPMs are transforming how engineers approach motor control, power conversion, and inverter design. By combining power switches, gate drivers, protection circuitry, and thermal monitoring in a single, compact package, IPMs simplify development, reduce failure points, and enable faster time-to-market.

Vishay Intertechnology, Inc. has introduced a new tricolor LED that provides luminous intensity to 2800 mcd at 20 mA for interior automotive lighting, RGB displays, and backlighting. Featuring separate anode and cathode connections for the red, green, and blue LED chips inside its compact 3.5 mm by 2.8 mm by 1.4 mm PLCC-6 surface-mount package, the Automotive Grade VLMRGB6122.. enables individual control of each chip, making it possible to realize every color within the color room defined by the gamut triangle area inside the CIE 1931 color space through color mixing.