STMicroelectronics, a global semiconductor player serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.

Wolfspeed, has announced the commercial launch of its 200mm SiC materials products, marking a significant milestone in the company’s mission to accelerate the industry’s transition from silicon to silicon carbide. After initially offering 200mm SiC to select customers, the positive response and benefits warranted a commercial release to the market.

Lithuanian energy supplier Ignitis Group, which specializes in renewable energy, has selected Rolls-Royce to supply large-scale battery storage systems from the mtu EnergyPack brand. The order comprises of systems with a total storage capacity of 582 megawatt hours and a total output of 291 megawatts, which will contribute to the power grid in Lithuania from 2027 onwards.

In the face of rapidly increasing e-waste due to technological advancements, this article delves into global management strategies, focusing on WEEE, EPR, and PCF. It highlights the environmental impacts, emerging waste streams, and the necessity for cohesive policies to address the escalating e-waste challenge effectively.

Most applications require efficient power conversion. A single IGBT won't do justice, but a group of IGBTs would! You can call these groups of power devices “power modules”. Power modules are increasingly becoming applicable in various industries such as renewables, electric vehicles, industrial automation, rail transportation, aerospace, data centres, telecommunications, and many more.

Silicon carbide and gallium nitride have remained a trending topic in the industry for about a decade. Experts try to prove one is better than the other, much like a rap battle. One thing is certain: the wideband gap duo has beaten silicon. It is only because silicon is not a true power semiconductor, but SiC and GaN are. The article compares SiC and GaN power modules and pinpoints where each wins.

This article describes modern heat treatment methods such as direct liquid cooling and thermoelectric coolers, improving thermal conductivity and reliability for demanding applications. Without considering thermal stress aspects that stem issues or attempting to reduce thermal resistance through complex internal connections, these procedures are intended for applications where efficient heat management is essential for performance and longevity.

Infineon Technologies AG and ROHM Co., Ltd have signed a Memorandum of Understanding to collaborate on packages for silicon carbide power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems and AI data centers.

GlobalWafers Co., Ltd. and Sustainable Energy Solution have teamed up to use offshore wind energy for the next 30 years. This agreement will produce enough electricity to power over 18,000 homes each year and significantly cut carbon emissions, helping GlobalWafers meet its renewable energy goals and support eco-friendly practices in the semiconductor industry.

SEMI Europe, along with over 75 semiconductor and microelectronics companies, research and technology organizations (RTOs) and trade associations, officially endorse the Declaration of the Semicon Coalition. Signed by all 27 European Union (EU) Member States, the declaration calls for a revised EU Chips Act to strengthen and revitalize Europe's position in the global semiconductor industry.