Resonac increases capacity to produce materials for AI Chips

ARTIFICAL INTELLIGENCE Resonac increases capacity to produce materials for AI Chips

2024-04-04 From Resonac Holdings Corporation 2 min Reading Time

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Resonac Corporation has decided to increase its capacity to produce materials for high-performance semiconductor chips, which are to be used mainly as CPUs for artificial intelligence, to 3.5 to 5 times of the current level. They will increase production of non-conductive film and thermal conductive sheet both of which have already been adopted by Resonac’s customers for use in high-performance semiconductor chips. Find out more in this article.

For the production of AI chips, Resonac is investing in equipment to produce non-conductive film and thermally conductive sheet's. Read more about it in this article.(Source: happystock - stock.adobe.com) — For the production of AI chips, Resonac is investing in equipment to produce non-conductive film and thermally conductive sheet's. Read more about it in this article.
(Source: happystock - stock.adobe.com)

Resonac plans to invest 15 billion yen in facilities to produce these materials and will commence operation of the expanded facilities in and after 2024 step-by-step. Scale of the market for artifical intelligence (AI) chips in 2027 is expected to expand to 2.7 times of that in 2022. Resonac will increase its capacities to produce non-conductive film (NCF) and thermal conductive sheet (thermal interface material: TIM) in a timely manner, thereby strengthening the company’s position in the market.

According to a report titled ‘Accenture Semiconductor Technology Vision 2019’, 77 percent of semiconductor executives surveyed said they have adopted AI in their business or are piloting the technology. (Bild: Adobe Stock)

NCF is utilized for connecting and stacking multilayers of high bandwidth memories (HBM), which is installed into high-performance semiconductor chips. NCF is required to have adhesive strength, realize reliable connection of devices, and have precise thickness with tolerance less than microns. Resonac has been producing NCF satisfying quality requirements by making the most of the company’s technologies and experience piled up over many years of development and production of die-bonding film, which is a predecessor of NCF.

Gallery

Resonac is increasing its production of non-conductive film.(Source: Resonac Holdings Corporation)

Thermal conductive sheet's are used to utilize the expediting heat radition from semiconductor chips.(Source: Resonac Holdings Corporation)

TIM is utilized for expediting heat radiation from high-performance semiconductor chips. TIM is required to have high thermal conductivity to expedite heat radiation from chips generating heat, reliability to endure repeated changes in temperature, and flexibility to adhere closely to fine asperities of chips and radiators. Resonac has been producing TIM satisfying performance requirements by utilizing the company’s original technology to add graphite particles to flexible sheet materials with special placement.

Can AI chips replace traditional chips in the future? Read more about their differences and similarities in this article. (Source: flyalone - stock.adobe.com)

Recently, it is said that evolution of high-performance semiconductor chips in the front-end process of semiconductor manufacturing is reaching the limits of improvement in technologies and cost performance in the front-end process. Therefore, in recent years, 2.xD and 3D semiconductor packaging technologies are becoming key technologies in manufacturing of semiconductor chips. In addition, utilization of 2.xD and 3D semiconductor packaging technologies is enabling semiconductor manufacturers to realize high-density mounting of semiconductor chips in the back-end process of semiconductor manufacturing and improve performance of chips. Resonac has been promoting R&D on next generation semiconductor packaging materials by utilizing Packaging Solution Center (PSC) and JOINT2 consortium. They will continue supporting evolution of high-performance semiconductor chips by promoting co-creation with semiconductor related companies inside and outside Japan.

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