Littelfuse, Inc. has announced the launch of the Littelfuse/C&K TDB Series, an ultra-miniature, half-pitch surface-mount DIP switch family engineered to support high-density PCB designs where space, reliability, and manufacturability are critical.
Littelfuse introduces ultra-miniature DIP switches designed for space-constrained electronic applications.
(Source: Littelfuse)
As electronic systems continue to shrink, design engineers face growing challenges fitting configuration and addressing switches into increasingly compact layouts without compromising electrical performance or assembly yield. The TDB Series addresses these challenges by significantly reducing the internal mechanism size, delivering a 1.27 mm half-pitch footprint that enables higher component density while maintaining robust electrical and mechanical reliability.
The TDB Series features gold-plated bifurcated contacts for stable, low-resistance signal integrity and a top-tape sealed construction that supports automated surface-mount soldering and post-reflow aqueous cleaning. Designed as a complementary solution to C&K’s TDA Series, the TDB Series expands design flexibility for applications requiring ultra-compact, surface-mount DIP switches.
With contact ratings up to 50 V DC, 100 mA (steady state), and a mechanical and electrical life of 1,000 cycles, the TDB Series supports reliable configuration settings across a wide range of low-power control systems. The switches are compatible with standard SMT processes and are supplied in tube or tape-and-reel packaging to support high-volume production environments.
“When space is critical, and reliability is non-negotiable, the TDB Series delivers exactly what design engineers need,” said Jesus Santos, Global Product Manager at Littelfuse. “Its ultra-miniature footprint, gold-plated contacts, and washable sealing enable confident designs even in dense, demanding applications.”
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