AC/DC flyback controllers from Nexperia enable higher power density GaN-based flyback converters

POWER DENSITY AC/DC flyback controllers from Nexperia enable higher power density GaN-based flyback converters

2024-10-23 From Nexperia 1 min Reading Time

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Nexperia has introduced a new series of AC/DC flyback controllers as the latest additions to its continuously expanding portfolio of power ICs. The NEX806/8xx and NEX8180x are designed for GaN-based flyback converters in devices such as power delivery chargers, adapters, wall sockets, strip sockets, industrial power and auxiliary power supplies, and other AC/DC conversion applications requiring high power density.

Controllers improve power efficiency and also reduce standby power consumption. Learn more about this here.(Source: Nexperia) — Controllers improve power efficiency and also reduce standby power consumption. Learn more about this here.
(Source: Nexperia)

The NEX806xx/NEX808xx are quasi-resonant/multi-mode flyback controllers which operate from a wide VCC range (10-83V), while the NEX81801/NEX81802 are adaptive synchronous rectifier controllers. These ICs can be used in combination with Nexperia’s NEX52xxx power delivery (PD) controllers and other discrete power device to deliver a turn-key flyback converter solution that optimizes the current sense voltage level and PFM mode, reduces standby power, and achieves high efficiency across the entire load range. The primary side controller can be used to drive a silicon MOSFET or GaN high electron mobility transistor (HEMT) directly, which helps to improve power density, while the synchronous rectification (SR) controller utilizes an innovative adaptive control method to eliminate the possibility of misconduction of switching device, thereby improving overall system reliability.

This article compares GaN HEMTs and SiC MOSFETs, two powerful transistors used in high-frequency and high-power applications, explaining their properties, pros, cons, and ideal uses. (Source: Natalia - stock.adobe.com)

This family of flyback controller ICs employs the TSOT23-6 flip-chip package to deliver better thermal performance and which also helps to prevent accidental triggering of the over temperature protection (OTP) function. The control circuit also includes additional protection features, making it ideally suited for use in consumer and industrial flyback power supply designs.

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