Oxidation of metal surfaces is a major challenge in electronics manufacturing, especially as devices shrink and performance demands grow. Traditional fluxes can leave residues, affecting functionality and reliability. Here plasma-based cleaning and coating processes offer an alternative, removing oxide layers in a gentle, chemical-free and inline manner. This improves surface quality, simplifies downstream processes and supports sustainable, highly efficient production. The technology is particularly suitable for sensitive applications such as semiconductors and power modules.

In this whitepaper you will learn more about:

• Surface Quality: Reliable removal of oxide layers for improved adhesion, performance and long-term stability of electronic components
• Miniaturization: Ideal for miniaturized components where conventional cleaning processes reach their limits
• Sustainability: No need for chemicals thanks to dry plasma application - environmentally friendly and residue-free
• Process Efficiency: Fully automated inline process for high efficiency and reduced production complexity
• Plasma Process Control: Improved process control through integrated data acquisition and complete traceability of components