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    Wolfspeed presents a 300 mm silicon carbide technology platform designed to support advanced packaging and high-efficiency power delivery for AI data center infrastructure. (Source: Wolfspeed)
    SIC TECHNOLOGY
    Wolfspeed unveils 300 mm SiC platform for AI data center packaging
    Left: the single-phase version of the SENTRON ECPD with RCM, right: a model of the future three-phase version of the SENTRON ECPD. (Source: Siemens)
    CIRCUIT PROTECTION
    Siemens expands semiconductor-based circuit protection portfolio
    Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image) (Source: © IF.arc - stock.adobe.com)
    SEMICONDUCTOR TECHNOLOGY
    Empower launches high-density silicon capacitors for AI processors
    Wolfspeed’s new 10 kV SiC MOSFET enables high-voltage power conversion for grid and industrial applications. (symbolic image) (Source: © CREATIVE- 3.4 - stock.adobe.com)
    SIC POWER DEVICES
    Wolfspeed launches first 10 kV SiC power MOSFET
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    PCIM Asia Shenzhen provides a platform for industry experts to present new developments in power electronics and electrification technologies. (symbolic image) (Source: © killykoon - stock.adobe.com)
    POWER INNOVATION
    PCIM Asia Shenzhen 2026 to highlight latest power electronics innovations
    The PCIM Conference 2026 will take place from June 9-11, featuring discussions on power electronics trends, including GaN technology and AI applications. (symbolic image) (Source: © Elmira - stock.adobe.com)
    POWER INNOVATION
    Over 500 presentations expected at PCIM Conference 2026
    Fraunhofer IAF coordinates the EU SUPREME project to accelerate GaN and SiC power semiconductor innovation in Europe. (Source: Fraunhofer IAF)
    POWER SEMICONDUCTORS
    EU funds SUPREME consortium for next-generation power semiconductors
    GlobalFoundries and Renesas strengthen their collaboration to support U.S.-based semiconductor production and supply chain resilience. (Source: © ronstik - stock.adobe.com)
    SEMICONDUCTOR MANUFACTORING
    GlobalFoundries and Renesas expand partnership to accelerate U.S. semiconductor manufacturing
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    Vehicle-to-grid (V2G) chargers enable bidirectional energy flow, allowing electric vehicles to act as mobile energy storage systems that can both draw power from and feed power back into the grid. (Source: © medienvirus - stock.adobe.com)
    ELECTRIC VEHICLES
    V2G bidirectional chargers
    Flexible: The solid silicone-based electrolyte is elastic, thereby compensating for the voids that form in solid-state batteries during charging and discharging.  (Source: Empa)
    BATTERY DEVELOPMENT
    A flexible electrolyte for solid batteries
    Both legacy and vGaN show higher carrier mobility and band gap energies compared to other power semiconductors. (Source: © phonlamaiphoto - stock.adobe.com)
    GALLIUM NITRIDE
    Onsemi’s new vGaN vs legacy GaN
    InGaAs-based photodetectors enable sensitive and fast detection in the short-wave infrared spectrum for modern sensing and communication applications. (Source: © VITALII - stock.adobe.com)
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    SWIR TECHNOLOGY
    InGaAs and Near-Infrared Optoelectronics
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    The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)
    MEASUREMENT TOOLS
    Keysight introduces Infiniium XR8 oscilloscopes for faster high-speed validation
    The R&S FPL1044 with the new RTSA option makes 40 MHz real-time frequency analysis available up to 44 GHz. (Source: Rohde & Schwarz )
    MEASUREMENT TOOLS
    New 44 ghz spectrum analyzer enables real-time signal analysis
    Thanks to cloud technology, users can collaborate on projects from anywhere and always have access to the latest planning data. (Source: SIEMENS)
    ELECTRICAL PLANNING
    Siemens advances electrical design in industry with new software
    Siemens accelerates student-led semiconductor innovation across Europe’s leading technical universities through Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton (Source: Siemens Digital Industries Software)
    INNOVATION EMPOWERMENT
    Siemens empowers Europe's future semiconductor innovators
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Whitepaper

PCIM 2025_Best Paper Award_Basler_Coverbild
PCIM 2025 - BEST PAPER AWARD

Highly-Integrated 1200 V GaN-Based Monolithic Bidirectional Switch

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

PCIM 2025_Young Engineer Award_Coverbild
PCIM 2025 - YOUNG ENGINEER AWARD

Compact Highly Integrated 1kW Peak Motor Drive

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

PCIM 2025_Young Researcher Award_Köhler
PCIM 2025 - YOUNG RESEARCHER AWARD

Machine Learning and Digital Twins for RUL Prediction of DC Semiconductor Circuit Breakers

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

PCIM 2025_Best Paper Award_Akiyama_Coverbild
PCIM 2025 - BEST PAPER AWARD

Low-Loss Active Gate Driver with Surge Voltage Detection for SiC MOSFET

This paper proposes a new gate driver that always achieves the fastest switching while keeping the surge voltage below the breakdown voltage.

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MEV Elektronik Service GmbH
MEV Elektronik Service GmbH
IQ Evolution GmbH
IQ Evolution GmbH
HVP High Voltage Products GmbH
HVP High Voltage Products GmbH
Arthur Behrens GmbH & Co. KG
Arthur Behrens GmbH & Co. KG
KOA Europe GmbH
KOA Europe GmbH
Rogers Corporation
Rogers Corporation
GVA Leistungselektronik GmbH
GVA Leistungselektronik GmbH
SPACE SE & Co. KG
SPACE SE & Co. KG
Koki Deutschland Niederlassung KOKI Europe A/S
Koki Deutschland Niederlassung KOKI Europe A/S
Aurubis Finland Oy
Aurubis Finland Oy
Diotec Semiconductor AG
Diotec Semiconductor AG
Greenconn Technology GmbH
Greenconn Technology GmbH
MBS - Hodde GmbH & Co. KG
MBS - Hodde GmbH & Co. KG
Heraeus Electronics GmbH & Co. KG
Heraeus Electronics GmbH & Co. KG
wts // electronic components GmbH
wts // electronic components GmbH
CISSOID S.A.
CISSOID S.A.
MERSEN
MERSEN
PCIM News Platform - MESAGO Messe Frankfurt GmbH
PCIM News Platform - MESAGO Messe Frankfurt GmbH
Johann Lasslop GmbH Induktive Bauteile
Johann Lasslop GmbH Induktive Bauteile
AIC Europe GmbH
AIC Europe GmbH

Webinars

PCIM 2025 Keynote_Johann Kolar (Stock Adobe - Chandlerlikes)
sponsored PCIM 2025 KEYNOTE

Challenges of Green Growth – Limited Energy Return on Energy Invested & Critical Raw Material Shortage

PCIM 2025 Keynote_Dushan Boroyevich (Stock Adobe - Zamrznuti tonovi)
sponsored PCIM 2025 KEYNOTE

Medium Voltage Power Electronics Building Blocks for Future Electronic Energy Networks

PCIM 2025 Keynote_Harrison (Stock Adobe - Mr image)
sponsored PCIM 2025 KEYNOTE

Monolithically Integrated GaN HEMT Bi-Directional Switch (BDS)

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Rogers Corporation

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