From 6 to 8 May, Nuremberg will once again become the global center of power electronics: The PCIM Expo & Conference is poised to bring experts from all over the world together to help advance forward-thinking developments in this dynamic sector. The event will feature a one-of-a-kind overview of innovative products, solutions, and trends that are expected to play a major role in shaping the industry’s future.

GlobalWafers, the world’s third-largest semiconductor wafer manufacturer and a founding member of the SEMI Global Semiconductor Climate Consortium, marks its third consecutive year partnering with SEMI in support of Earth Day on April 22.

Texas Instruments has introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making.

Diodes Incorporated has announced the expansion of its silicon carbide product portfolio with a series of five high-performance, low figure-of-merit 650V SiC Schottky diodes.

This article outlines the system requirements for the Open Compute Project Open Rack Version 3 (OCP ORV3) battery backup unit (BBU). It emphasizes the importance of having an efficient and intelligent BBU that can provide energy during power outages. Additionally, it will showcase the analog and digital design solutions, electrical and mechanical solutions, and their architectures that are developed to meet the written specifications.

This article describes the algorithm developed by Analog Devices for the Open Compute Project Open Rack V3 battery backup unit for the battery management system, an essential device of any data center battery backup unit. Its primary responsibility is to ensure the safety of the battery pack by monitoring and regulating its state of charge, health, and power. Because of this, it is important to design and implement the battery management system with great care as it is a complex and important component in the data center.

The semiconductor industry is on track to hit $1 trillion by 2030, but growth is threatened by cost pressures, supply chain fragility, and a deepening talent shortage. This article unpacks the real-world implications for power engineers tasked with scaling systems under structural and logistical constraints.

Did you know that a DIAC is a combination of a diode and a thyristor? Despite structural and operational differences, diodes and thyristors can be combined to make a different device. In popular media, DIAC is sometimes called the diode of AC circuits. The article explains DIACs and their structure, operation, and applications.

The article lists the five smallest power devices. But does the miniaturization of power devices depend upon Moore’s law? Would the industry integrate trillions of transistors to perform simple operations like power conversion and control? The article also discusses Moore’s law’s impact on power devices.

Thyristors are known for their high-power handling capacity and latching-on property. However, they often fail during the turn-on and turn-off processes. If the dv/dt and di/dt are high enough, they are often the reason for failure. The article explains thyristor failure and potential solutions.