Each semiconductor chip has a circuit design to operate and perform its designated function. These circuits are first designed, simulated, and tested on EDA (electronic design automation) tools. In fabrication facilities (fabs or foundries), circuits are often called patterns. The complex manufacturing processes enable the precise creation of detailed patterns on chips.

The word “wafer” points to the semiconductor manufacturing process. In fact, a wafer is the foundation of semiconductor fabrication. But did you know that a semiconductor manufacturing plant transforms “sand” into a wafer, eventually leading to the “small black chip”? The second article of the semiconductor manufacturing series explains the highly popular wafers and the processes involved. The article mainly discusses silicon wafer production and lists some other wafer materials as well.

Semiconductor Manufacturing is a critical industrial process that leads to mankind’s easy tech-based lifestyle through consumer electronics, appliances, electrical vehicles, IoT, and many more applications. This five-part article series details the process of semiconductor manufacturing straightway from the books to the one inside the phone in your pocket. This article discusses the basics of semiconductor manufacturing and some statistics.

The power electronics industry comprises numerous materials, devices, and systems, applied across many diverse applications. Incessant evolution and expansion in user demand is met by constant innovation and new product introductions.

A plan by ROHM Co., Ltd. and Toshiba Electronic Devices & Storage Corporation to collaborate in the manufacture and increased volume production of power devices has been recognized and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.

LEM has launched the HAH3DR S07/SP42, a new compact current sensor designed for 800V three-phase power modules. Developers of automotive traction inverters are increasingly using three-phase power modules such as the popular and widely proven Hybridpack Drive from Infineon. These modules are now adopting the more efficient SiC MOSFET technology, allowing vehicles to use 800V battery systems that offer faster charging and longer driving range.

November 2023 has an achievement to bring to the world of science and technology. The team of genius physicists from MIT claim that they have successfully developed a flat band in a three-dimensional crystal structure.

Northvolt announced a state-of-the-art sodium-ion battery, developed for the expansion of cost-efficient and sustainable energy storage systems worldwide. The cell has been validated for a best-in-class energy density of over 160 watt-hours per kilogram at the company’s R&D and industrialization campus, Northvolt Labs, in Västerås, Sweden.

In the podcast “Sound on. Power on.”, host David Hegarty joins global leaders to discuss trends, challenges and drivers of the power electronics industry. Expect fresh thoughts from interesting and prestigious experts in snackable 20 minutes episodes. Descriptions and transcripts can be found by clicking on the specific episode.

The common black packaging of the semiconductors gave rise to the word “chips” as a synonym. Packaging is the final procedure of microfabrication that takes an IC from fabs to the inventories/markets. The final/sixth article in the semiconductor manufacturing series discusses the packaging process and lists various types of IC packages.