On June 27, an inauguration ceremony was being held in Penang, Malaysia for LEM's new production plant. The ceremony was attended by the Chief Minister of Penang, the Chairman and CEO of LEM, together with invited guests including the Swiss Ambassador to Malaysia. The project was first announced in 2020, and now marks a major step in its construction with the first electric current sensor products expected to come on-line in Q1 2024.

555 Timer IC has continued to rule the world’s chip market since the seventies. Often addressed as among the “greatest chips”, the 555 Timer IC is a best-selling analog semiconductor. The Signetica-introduced chip is capable of producing desirable oscillations and output waveforms for an engineer.

Nordic Semiconductor and Amber Semiconductor, Inc. announced that they have entered a multi-faceted partnership to explore sales, marketing, and development initiatives to bring new solutions to markets, such as smart electrical products, and other wirelessly integrated applications.

United Microelectronics Corporation (“UMC”), a global semiconductor foundry, announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.

Mitsubishi Electric Corporation announce that it will enter into a strategic partnership with Nexperia B.V. to jointly develop silicon carbide (SiC) power semiconductors for the power electronics market. Mitsubishi Electric will leverage its wide-bandgap semiconductor technologies to develop and supply SiC MOSFET chips that Nexperia will use to develop SiC discrete devices.

Valens Semiconductor, a premier provider of high-performance connectivity solutions for the audio-video and automotive markets, announced the launch of the VS6320 chipset, a USB3.2 Gen1 extension solution. Valens Semiconductor’s VS6320 provides a high-performance and efficient long-distance single-chip extension solution that addresses a critical need in the global videoconferencing, information technology (IT), industrial and medical markets.

A cross-organizational team from Rigaku SE and Fraunhofer IISB has established a new semiconductor material characterization method.They succeeded not only in developing an industry-ready X-ray topography system, but also in employing defect detection and quantification algorithms, achieving a worldwide unique material characterization method for silicon carbide (SiC) wafers.

Nexperia, a semiconductor expert, announced it has entered into partnership with KYOCERA AVX Components GmbH, a international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon carbide (SiC) rectifier module for high frequency power applications.

Cambridge GaN Devices (CGD), has signed a tripartite agreement with Chicony Power Technology Co., Ltd of Taiwan and Cambridge University Technical Services (CUTS), UK, to conceive and develop advanced, efficient, high power-density adapters and data centre power products using GaN.

The recent buzz in the world of science and technology, the room-temperature superconductor “LK-99”, is not a superconductor anymore. The overhyped copper-doped lead apatite named LK-99 seems to be a room-temperature superconductor only in the inventor's research paper.