The Chip-on-Board (COB) LED is one of the latest and most advanced entrants to the LED market, but what is it that makes these LEDs much brighter, consume less power, and output a higher quality beam than the older LED technologies?

This article is the second of a 2-part series and focuses on the specifics of power budgeting and board layout. As many application boards require a number of power rails, this series examines a multisupply board solution. The goal is to achieve a quality initial design with good component placement and routing to highlight some power budget and routing tips and tricks.

In groundbreaking research, scientists from two Swedish research institutions have managed to build a structural battery that yields experimental results ten times better than anything we’ve seen before.

Researchers in the U.S. claim to have developed a liquid-metal battery that could be used to provide more power than current lithium-ion batteries while also being able to charge faster.

At PCIM Europe 2022, Jurgen Rechberger, the Vice President of Hydrogen & Fuel Cell at automotive company AVL, which is a world leader in the development and testing of powertrain systems, delivered a keynote discussing the critical role of hydrogen in further detail.

TSMC has announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform® (OIP) 3DFabric Alliance. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.

Nexperia, the industry expert in essential semiconductors, has recently announced a new range of GaN FET devices that reportedly achieve superior switching FOMs and on-state performance with improved stability.

Emitech, a French specialist in environmental testing to ensure compliance with applicable standards and regulations, has announced the inauguration of its new test centre dedicated to the electromagnetic compatibility (EMC) of electronic equipment, as well as vehicle homologation and large system qualification.

Since launching in September 2022, UK based Pulsiv Limited has gained widespread attention with its unique technology for designing more energy efficient power supplies and battery chargers. Pulsiv OSMIUM microcontrollers and AC to DC front-end circuit configurations are already available and now to accelerate R&D, the first in a series of reference designs has been officially launched to the market.

Infineon Technologies AG is extending its cooperation with silicon carbide suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The new set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade.