Valeo and ROHM Semiconductor collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack to Valeo for future powertrain solutions.

Worldwide electricity consumption is expected to rise at its fastest rate in recent years; however, the aggregated growth in renewable and nuclear sources is expected to cover this increased demand. This article discusses how diverse technology trends will be helping to maintain this balance.

Demand for mobile data is growing at a steep rate as new markets and applications continue to emerge. There are no other solutions than to deploy additional cellular sites in greater density. These factors will directly affect the design of macrocell, small cell, and femtocells products. The radios are now multiband, and power amplifier design engineers are pushing the PAs’ output power to higher limits/levels. This article focuses on 80 W PAs with several PAs in the system.

ROHM has developed 650V GaN HEMTs in the TOLL package: the GNP2070TD-Z. Featuring a compact design with excellent heat dissipation, high current capacity, and superior switching performance, the TOLL package is increasingly being adopted in applications that require high power handling, particularly inside industrial equipment and automotive systems.

Porsche AG acquired V4Drive GmbH from the VARTA AG-Group on 4 March 2025. The sports car manufacturer is the new majority shareholder of the company, while VARTA AG will retain a minority stake without any operational influence.

Greenconn Corporation, a world-leading manufacturer of connector solutions, is steadily advancing its international expansion strategy. In a comprehensive update, the company announces several groundbreaking developments from recent months — a new opened production facility in Vietnam is only one of them.

ROHM Semiconductor Europe is looking forward to electronica 2024 – the world’s leading trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between November 12th to 15th in Munich.

Caltest Instruments GmbH is pleased to announce its future collaboration with GW Instek. GW Instek, known in the measurement and test industry for a variety of products including oscilloscopes, spectrum analyzers, function generators, high voltage test sets and AC and DC power supplies.

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany officially unveiled its new Chiplet Application Hub. Designed to serve as a central platform for the development and application of chiplet technologies, the hub aims to bridge the gap between research and industrial use.

The global chip industry hit record sales in early 2025, but demand for AI chips and advanced packaging is still outpacing supply. TSMC, Intel, and Samsung are struggling with yield and production issues.