Impact of Current Density on Wire Bond Lifetime

Power Cycle Testing with Clamped VCE for Realistic Current Stress

This paper presents experimental results on the impact of current density on wire bond lifetime and introduces a novel power cycling test method that allows for testing with moderate currents.

Power cycle testing is the established method to assess IGBT modules’ lifetime. In a highly accelerated test, the end-of-life failure modes are provoked by repetitive DC current pulses. However, in real-life inverter operation a big portion of the power losses is produced by switching events and much smaller current densities are present in the module. Especially the wire bond lifetime depends on the current density and exaggerated test load currents can lead to early wire bond lift-off.

The provider of this whitepaper

Siemens Aktiengesellschaft

Werner-von-Siemens-Straße 1
80333 München
Deutschland

pcim-news-platform-logo-firmenprofil (Mesago)

PCIM News Platform - MESAGO Messe Frankfurt GmbH

Rotebühlstr. 83-85
70178 Stuttgart
Deutschland

Phone : +49 711 61946-0

Contact form
Best Paper Award 2023 Cover_Ralf Schmidt

 

Download free whitepaper

Welcome to PCIM News Platform