Increasing the operating temperature of power devices in automotive applications not only improves the power density but also simplifies the cooling systems. The development of compound semiconductors such as SiC, GaN, and GaO, which allow for higher operating temperatures over 200 °C, accelerates this trend. However packaging materials are not applicable to higher operating temperatures. In particular, die bonding material and insulation materials suffer from severe thermal strain. Therefore Resonac Materials has developed and is continuing the deployment of SiC Epi Wafers, Cu sintering material, High heat Polymide-Imide coating, Epoxy molding compound as well as AI cooler device.