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:quality(80)/p7i.vogel.de/wcms/10/fc/10fcb98e44d61826e641bc8d3f20f616/0133193677v2.jpeg "The new AEVA and AEVB Series aluminum electrolytic capacitors are engineered for harsh industrial environments, delivering high-CV, long-lifetime performance in compact, surface-mount packages that reliably withstand up to 30g acceleration and operating temperatures extending from -55° to +125°C. (Source: Kyocera)")
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:quality(80)/p7i.vogel.de/wcms/a4/29/a429b944eb0a69e268015f8300ba8940/0133311989v2.jpeg "Hitachi Energy and Daikin are establishing a German supply of C4‑FN, a specialty insulating gas used in SF₆‑free high‑voltage equipment for more sustainable power grids. (Source: © Ahmed - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/d5/32/d5326e4b05d5cd759e88062f1c0b097a/0133344193v2.jpeg "Co-packaged optics is the latest innovation in data centers where optical modules on silicon chips can assist in scaling megawatt AI infrastructure. (Source: © Rachakrit - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/76/a9/76a9333bc7c6abbf7e29d1b910edb5e2/0133335959v2.jpeg "This article explains PMBus in data center power supplies. (Source: © Gibster - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/35/9c/359cfb6c855204e4d114f88cf5b98b5f/0133078984v2.jpeg "Photonic integrated circuits are next-level chips that will dominate data centers in the upcoming years. (Source: © pier - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/7b/76/7b76005554b556df2a7a3794bdf69d44/0132365246v2.jpeg "Hioki’s ST5680A DC Hipot Tester combines CE/UKCA/CSA compliance, an integrated capacitance‑based contact check and time‑series waveform recording (voltage, leakage current, insulation resistance) to standardize hipot and insulation testing across EV cell, module and pack production lines. (Source: Hioki)")
:quality(80)/p7i.vogel.de/wcms/af/7f/af7f7b0fb7f29219fc991b1130f65477/0132241333v2.jpeg "Comprehensive laboratory testing regimens—combining thermal cycling, high‑current stress, EMC, and accelerated lifetime tests—are essential to validate advanced power designs and ensure reliability in real‑world applications. (Source: PRBX)")
:quality(80)/p7i.vogel.de/wcms/16/3d/163df69363f8125315a9826e13ea4b05/0131927425v2.jpeg "Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure. (Source: Cadence)")
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Sep 15, 2026
High-Reliability Solder Preforms for Cost-Optimized Power Module Attach
Reducing costs without compromising reliability, that's exactly the balancing act many power module manufacturers face today.
As silver prices remain volatile and performance requirements continue to increase, engineers and procurement teams are under growing pressure to optimize both cost and long-term reliability.
Our latest blog explores how the right solder preform can help achieve both.
You'll learn:
✔ Why module attach material selection has become a strategic decision
✔ How low-silver solder preforms help reduce precious metal costs
✔ Why reliability starts with the right alloy—and goes beyond it
✔ When soldering may be the better choice over sintering
Whether you're designing the next generation of power modules or looking to optimize your manufacturing costs, the article provides practical insights to help you make the right material choice.
Read the full article here: High-Reliability Solder Preforms for Cost-Optimized Power Module Attach
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