Empower launches high-density silicon capacitors for AI processors

SEMICONDUCTOR TECHNOLOGY Empower launches high-density silicon capacitors for AI processors

2026-03-10 From Empower Semiconductor 1 min Reading Time

Related Vendors

Arthur Behrens GmbH & Co. KG

Diotec Semiconductor AG

ROHM Semiconductor GmbH

Empower Semiconductor announced the launch of three new embedded silicon capacitors (ECAPs), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors.

Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image)(Source: © IF.arc - stock.adobe.com) — Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image)
(Source: © IF.arc - stock.adobe.com)

The new ECAP portfolio includes the EC2005P, with 9.34μF capacitance in a 2mm x 2mm package; the EC2025P, offering 18.68μF capacitance in a 4mm x 2mm package; and the EC2006P, providing 36.8μF capacitance in a 4mm x 4mm form factor.

As AI processors push the limits of performance, power delivery has emerged as a critical constraint. Achieving the required power integrity for extreme current densities and ultrafast transient response is no longer realistic with board-level mounted components; embedding capacitors into the processor substrate is now essential. Empower Semiconductor’s ECAP portfolio is leading the industry initiatives to embed high-density silicon capacitors, unlocking the power integrity required to scale next-generation processor performance.

“Our customers are under intense pressure to deliver greater performance with tighter power margins,” said Steve Hertog, Senior Vice President Worldwide Sales, Empower Semiconductor. “These new ECAPs are a proven and practical way to deploy higher capacitance density into a smaller footprint right at the package level of the AI processor.”

The new B43655 and B43656 series will also be implemented in TDK’s web-based AlCap Useful Life Calculation Tool. (Source: TDK Electronics AG)

Empower’s new ECAP solutions feature ultralow equivalent series inductance (ESL) and equivalent series resistance (ESR). The wide bandwidth ultralow impedance delivers optimal power delivery network (PDN) performance and significantly improves overall power integrity. Each device has been engineered from a packaging perspective to meet the strict dimensional and tolerance requirements necessary for embedded deployment within AI and HPC processors.

Follow us on LinkedIn

Have you enjoyed reading this article? Then follow us on LinkedIn and stay up-to-date with daily posts about the latest developments on the industry, products and applications, tools and software as well as research and development.

(ID:50777850)

Subscribe to the newsletter now

Don't Miss out on Our Best Content

Business E-mail

Please enter a valid mailadress.

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy.

Declaration of consent

It goes without saying that we treat your personal data responsibly. Where we collect personal data from you, we process the data in compliance with the relevant data protection regulations. More detailed information is available in our privacy policy.

Consent to the use of data for advertising purposes

I consent to the use of my email address to send editorial newsletters by Mesago Messe Frankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany including all of its affiliates within the meaning of Section 15 et seq. AktG (‘Mesago’). I have viewed lists of each group of affiliates here for the Mesago.
The content of the newsletter covers the products and services of all of the companies listed above including, for example, trade magazines and specialist books, events and exhibitions and event-related products and services, printed and digital media products and services such as additional (editorial) newsletters, competitions, lead campaigns, online and offline market research, technical web portals and e-learning courses. If my personal telephone number has also been collected, it may be used to send offers for the aforementioned products and services from the above companies, as well as for market research purposes.
If I wish to access protected content online on portals of Mesago including its affiliates within the meaning of Section 15 et seq. AktG, I must register with additional data in order to access that content. In return for this free access to editorial content, my data may be used in line with this declaration of consent for the purposes described herein.

Right to withdraw consent

I am aware that I can withdraw this consent at any time with future effect. My withdrawal of consent does not affect the lawfulness of processing performed based on my consent before its withdrawal. If I wish to withdraw my consent, I can send an email to Mesago at privacy@mesago.com. If I no longer wish to receive individual newsletters to which I have subscribed, I can also click on the unsubscribe link at the bottom of a newsletter. I can find more information on my right to withdraw, how to exercise this right and the consequences of my withdrawal in the Privacy policy Editorial newsletters section.