This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This paper proposes a new gate driver that always achieves the fastest switching while keeping the surge voltage below the breakdown voltage.

This paper proposes using semiconductive materials in the manufacturing of the medium voltage (MV) coil former for medium-frequency transformers.

Metal oxidation challenges electronics manufacturing. Plasmatreat’s REDOX®-Tool delivers a reliable, eco-friendly inline solution for oxide removal, ensuring top-quality products for high-performance demands.

At the PCIM Europe Conference 2024, Adriana Campos from the SuperGrid Institute, France, was honored with the Young Engineer Award.

At the PCIM Europe Conference 2024, Andreas Horat, Power Electronic Systems Laboratory, ETH Zurich, was honored with the Young Researcher Award.

This study will show modified insulation materials to increase the robustness of IGBT-modules against H₂S-driven failure mechanisms.

This paper compares the novel sensor gap transmission line pulsing (sgTLP) technique with the established method of double-pulse testing (DPT) for characterizing parasitic inductances in a fast SiC half-bridge power module.

This paper introduces a partial-load Triangular Current Mode (TCM) modulation concept for high efficiency traction drive applications without compromising peak performance.

Despite the advance of semiconductor technology and the shift towards highly integrated digital electronics, every design engineer should have a solid knowledge base of analogue techniques.

This application note discusses the use of programmable sources and loads in boosting the development of microinverters and electric vehicle (EV) projects in the context of renewable energy.

Tektronix dives into the most common methodology for dynamic characterization of wide bandgap switching devices and discuss best practices and setup to determine accurately all switching parameters.

Choosing the optimum programmable AC source or DC supply for your application extends well beyond choosing AC or DC and a voltage, current, and frequency rating.

There is a growing demand for more effective assembly technologies. This paper presents the results of laser welding, which connects the copper (Cu) terminal to the Direct Copper Bonded (DCB) substrate within the power semiconductor discrete package.

Learn how to enable your Oscilloscope to carry out stable and accurate measurements on PWM waveforms.

This paper proposes an advanced high-speed protection scheme based on a wide-bandgap (WBG) semiconductor.

This paper presents the prototype of a 200-kW two-stage converter based on the cascade association of a Three-Level Boost Chopper and a Solid-State Transformer.

This paper presents a machine-learning approach to model semiconductor junction temperatures.

This paper presents experimental results on the impact of current density on wire bond lifetime and introduces a novel power cycling test method that allows for testing with moderate currents.