Rogers Corporation

ROLINX PowerCircuit Solutions provide an answer to the challenge faced by designers who need a solution for power distribution in low power applications with currents greater than 100 amps. They require both the high volume assembly capabilities of PCBs and the current carrying capabilities of laminated busbars. ROLINX PowerCircuit Solutions bridge this gap by combining the advantages of both technologies in a single component: excellent thermal management, high volume assembly process and 3D capabilities. PowerCircuit also offers copper thickness of 400-800µm and a current range of 100-500Amp. ROLINX PowerCircuit Solutions are ideal for use in EV/HEV, DC/DC converters, motor drives, clean energy and industrial converter applications.

Features:

• Combines the advantages of PCB and laminated busbar in a single component
• Carries voltage up to 0.8 kV DC
• Current range of 100-500 Amp
• Copper thickness of 400-800µm
• Power up to 200 kW
• Temperature range of -50°C to +125°C
• Relative humidity of 55°C/95% RH

Benefits:

• Low inductance
• Good thermal management
• Fit for high volume assembly processes and interconnection techniques
• Proven technology
• Compact 3D design
• Wave soldering capability