Rogers Corporation

Our curamik CoolPower and curamik CoolPower Plus are high performance copper coolers for high power electronics. These can be used in high-performance electronics, high brightness LED and solar-cell arrays.

curamik CoolPower Features:

• Several layers of pure copper create three-dimensional structures for cooling
• Hermetically sealed during curamik bonding process

curamik CoolPower Plus Features:

• Including the curamik CoolPower Features listed above
• Integrated Direct Bond Copper (DBC) coolers with Al2O3 or AlN ceramic substrates

curamik CoolPower Benefits:

• curamik bonding process avoids the need for any additional soldering or adhesive layers that negatively impact thermal resistance
• More efficient cooling than traditional module structures with liquid cooling

curamik CoolPower Plus Benefits:

• Including the curamik CoolPower Benefits listed above
• DBC substrate-layers enable direct assembly (chip on board)
• DBC substrate-layers provide electrical insulation from cooling circuit